category: Whitepapers

category: IoT, Security & Automotive

4 Tips For 5G New Radio Signal Creation
By Keysight - 27 Apr, 2022 - Comments: 0

5G NR requires you to think differently about how you design and test devices. Learn the four tips to help you successfully generate 5G NR test signals to get your designs to market faster. Click here to read more. » read more

Semiconductor Scaling Is Failing — What Next For Processors?
By Codasip - 27 Apr, 2022 - Comments: 0

This in-depth paper looks at the changing dynamics in the semiconductor industry. In other words, why many companies are looking to customize their processor designs to keep pace with software and system demands. It goes onto highlight the opportunities available to companies of all sizes, in seeking to differentiate and specialize their processor designs. Click here to read more. » read more

Advances In EM Analysis And Design Flows For RF System Development
By Cadence - 27 Apr, 2022 - Comments: 0

With the move toward higher frequencies and component densities, RF/mixed signal PCB systems and heterogeneous system-in-package (SiP) technologies are increasingly susceptible to delayed product development turnaround times that threaten delivery schedules. These delays often occur late in development during integration when components that met the design specifications fail to achieve the req... » read more

Streamlining Vehicular Electrical System Design And Verification
By Synopsys - 27 Apr, 2022 - Comments: 0

Automobiles and other road vehicles such as trucks and buses have always been one of the most demanding applications for mechanical and electrical design. Systems must operate properly over a wide range of environmental conditions, facing extremes of temperature, humidity, sunlight, dirt, vibration and more. User expectations of reliability and availability mandate safety-critical design practi... » read more

Vehicle Electrification Driving Supply Chain Evolution
By Amkor - 20 Apr, 2022 - Comments: 0

Dr. Ajay Sattu, Director, Automotive Product Marketing, Amkor Technology, Inc. If the recently concluded CES 2022 is any indication, the automotive industry is yet again in the cross hairs of both consumers and industry experts alike. Whether it’s the new electric vehicle (EV) model introductions, color changing technologies, or concept cars, automotive companies are slowly transforming th... » read more

A Single-Layer Mechanical Debonding Adhesive For Advanced Wafer-Level Packaging
By Brewer Science - 20 Apr, 2022 - Comments: 0

Better performance and lower cost are always key trends being pursued in the semiconductor industry. Moore's law has provided a very well-defined relationship between performance and cost and the semiconductor industry has followed this law for the past several decades with no issue. However, it became more and more difficult for foundries and integrated device manufacturers (IDMs) to scale to ... » read more

Durability And Cost Benefits Drive Mil-Aero Demand For OCPP
By QP Technologies - 20 Apr, 2022 - Comments: 0

Ceramic packages were, for many years, the option of choice for semiconductor prototype assembly, particularly in military-aerospace applications. They are able to withstand high temperatures and can be hermetically sealed. However, they can be costly and, while they allow for rapid assembly of first samples, the final product is typically a plastic package, so the ceramic prototype doesn’t o... » read more

Yield Enhancement By Virtual Fabrication
By Coventor - 20 Apr, 2022 - Comments: 0

This paper provides an example of yield enhancement using virtual fabrication. A 6 transistors based static random access memory example on 7nm node technology was used in this case study. Yield loss caused by via contact-metal edge placement error was modeled and analyzed. The results show that yield can be enhanced from 48.4% to 99.0% through process window optimization and improved specifica... » read more

Automated DRC Voltage Annotation Provides Faster And More Accurate Verification For Voltage-Aware Spacing Rules
By Siemens EDA - 13 Apr, 2022 - Comments: 0

Accurate and repeatable reliability verification is now essential for both advanced node designs and the increasingly complex products being produced at established nodes. To ensure compliance with all process, reliability, and power management requirements, voltage-aware DRC applies variable spacing requirements, based on either the absolute voltage or delta voltage values, to accurately evalu... » read more

Key Applications For In-Chip Monitoring IP
By Synopsys - 13 Apr, 2022 - Comments: 0

The latest SoCs on advanced semiconductor nodes especially FinFET, typically include a fabric of sensors spread across the die and for good reason. But why and what are the benefits? This article explores some of the key applications for In Chip monitoring and why embedding In Chip monitoring IP is an essential step to maximize performance and reliability and minimize power, or a combination of... » read more

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