category: Videos

category: IoT, Security & Automotive

100G Ethernet At The Edge
By Ed Sperling - 19 Apr, 2023 - Comments: 0

The amount of data is growing, and so is the need to process it closer to the source. The edge is a middle ground between the cloud and the end point, close enough to where data is generated to reduce the time it takes to process that data, yet still powerful enough to analyze that data quickly and send it wherever it is needed. But to make this all work requires faster conduits for that data i... » read more

How Curvilinear Mask Writing Affects Chip Design
By Ed Sperling - 12 Apr, 2023 - Comments: 0

As chips become more complex and features continue to shrink, it becomes more difficult to print shapes on photomasks. The ability to print curvilinear masks changes that equation, but not all of the pieces in the flow are automated today. Aki Fujimura, CEO of D2S, talks about what has to change, what will the impact be on design rules, and why using curvilinear shapes can shrink the manufactur... » read more

Adding Security Into Test
By Ed Sperling - 04 Apr, 2023 - Comments: 0

Security is becoming a much bigger concern as more electronics are added into cars, as more devices are connected to the internet, and as the value of data continues to increase. The problem is that security is dynamic. It continues to change throughout the lifetime of a system, and some of these devices are expected to last for a decade or more. Lee Harrison, director of Tessent product market... » read more

Impact Of Increased IC Performance On Memory
By Ed Sperling - 30 Mar, 2023 - Comments: 0

Increasing performance in advanced semiconductors is becoming more difficult as chips become more complex. There are more physical effects to contend with, different use cases, and challenges in making memory go faster. In addition, aging effects that once were ignored are now becoming critical concerns. Steven Woo, fellow and distinguished inventor at Rambus, talks about different factors that... » read more

Physically Aware NoCs
By Ed Sperling - 06 Mar, 2023 - Comments: 0

More functions, greater security risks, and increasingly complicated integration of IP and various components below 7nm is increasing the time and effort it takes to get a functioning chip out the door. In many of these devices, the network on chip is the glue between various components, but it can take up to 10% to 12% of the total area of the SoC. Andy Nightingale, vice president of product m... » read more

Zero Trust Security In Chip Manufacturing
By Ed Sperling - 08 Feb, 2023 - Comments: 0

More equipment vendors and more IP are making the data in a fab much more valuable than in the past, and a potential target for hackers. What’s needed is a different approach to architecting and deploying services and equipment, so breaches can be stopped before they affect other equipment and data, and a better way of sharing data. Brian Buras, production analytics solution architect at Adva... » read more

Where Power Is Spent In HBM
By Ed Sperling - 06 Feb, 2023 - Comments: 0

HBM is gaining ground because of a spike in the amount of data that needs to be processed quickly, but big reductions in power are possible if that processing can be moved closer to the HBM modules, and if more can be done in each compute cycle without sending data back and forth to memory as frequently. Steven Woo, fellow and distinguished engineer at Rambus, talks about what can be done to bo... » read more

Improving PPA When Embedding FPGAs Into SoCs
By Ed Sperling - 31 Jan, 2023 - Comments: 0

Embedded FPGAs have been on everyone’s radar for years as a way of extending the life of chips developed at advanced nodes, but they typically have come with high performance and power overhead. That’s no longer the case, and the ability to control complex chips and keep them current with changes to algorithms and various protocols is significant step. Geoff Tate, CEO of Flex Logix, talks a... » read more

Choosing The Right Memory At The Edge
By Ed Sperling - 09 Jan, 2023 - Comments: 0

As the amount of data produced by sensors in cars and phones continues to grow, more of that data needs to be processed locally. It takes too much time and power to send it all to the cloud. But choosing the right memory for a particular application requires a series of tradeoffs involving cost, bandwidth, power, which can vary greatly by device, application, and even the data itself. Frank Fer... » read more

Multi-Die Integration
By Ed Sperling - 04 Jan, 2023 - Comments: 0

Putting multiple heterogeneous chips is the way forward for improved performance and more functionality, but it also brings a host of new challenges around partitioning, layout, and thermal. Michael Posner, senior director for die-to-die connectivity at Synopsys, talks about the advantages of 3D integration, why it’s finally going mainstream, and what’s needed in the EDA tools to make this ... » read more

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