Five Emerging DRAM Interfaces You Should Know For Your Next Design

Demands for increased bandwidth, low-power consumption and a small footprint exacerbate complexity for the mobile market.


Producing DRAM chips in commodity volumes and prices to meet the demands of the mobile market is no easy feat, and demands for increased bandwidth, low power consumption, and small footprint don’t help. This paper reviews and compares five next-generation DRAM technologies— LPDDR3, LPDDR4, Wide I/O 2, HBM, and HMC—that address these challenges.

To view this white paper, click here.

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