A new technical paper titled “Energy-/Carbon-Aware Evaluation and Optimization of 3D IC Architecture with Digital Compute-in-Memory Designs” was published by researchers at Cornell University.
“In this paper, we investigate digital CIM (DCIM) macros and various 3D architectures to find the opportunity of increased energy efficiency compared to 2D structures. Moreover, we also investigated the carbon footprint of 3D architectures,” states the paper.
Find the technical paper here. October 2024.
H. J. Byun, U. Gupta and J. -S. Seo, “Energy-/Carbon-Aware Evaluation and Optimization of 3D IC Architecture with Digital Compute-in-Memory Designs,” in IEEE Journal on Exploratory Solid-State Computational Devices and Circuits, doi: 10.1109/JXCDC.2024.3479100.
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