How the Fusion Compiler handles advanced process nodes and delivers up to 20% better performance, power and area.
The semiconductor industry is going through a renaissance period with waves of technological advancements and innovation. There has been a significant uptick in demand for silicon in recent years, driven by market sectors including automotive, artificial intelligence, cloud computing, and internet of things (IoT) that have their own unique mix of design and implementation requirements. The mobile communication sector is preparing for the introduction and ramp up of the 5G wireless standard—with a peak data rate of 20 gigabits per second (Gb/s), it is a 10X increase over the current 4G standard. Along with the increased performance, mobile integrated circuits (ICs) must also be low power to achieve the full day battery demands of consumers. In the automotive sector, consumers are demanding more entertainment, navigation, and safety features integrated in a seamless, hands-free experience where reliability is the primary requirement. Artificial intelligence enhances the user experience by offering real time analytics, such as face recognition and object detection that requires dense, high-performance ICs. IoT-based smart devices are rapidly invading homes and businesses in the form of light bulbs, thermostats, and smoke detectors that demand low cost and energy efficiency.
This white paper discusses how Fusion Compiler is architected to address the many challenges encountered at advanced process nodes for leading-edge design to deliver 2X faster time to results and up to 20% better performance, power and area.
Read more here.
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