Why Chips Die


Semiconductor devices contain hundreds of millions of transistors operating at extreme temperatures and in hostile environments, so it should come as no surprise that many of these devices fail to operate as expected or have a finite lifetime. Some devices never make it out of the lab and many others die in the fab. It is hoped that most devices released into products will survive until they be... » read more

Design For Advanced Packaging


Advanced packaging techniques are viewed as either a replacement for Moore's Law scaling, or a way of augmenting it. But there is a big gap between the extensive work done to prove these devices can be manufactured with sufficient yield and the amount of attention being paid to the demands advanced packaging has on the design and verification flows. Not all advanced packaging places the same... » read more

Fusion Compiler: Comprehensive RTL-to-GDSII Implementation System


The semiconductor industry is going through a renaissance period with waves of technological advancements and innovation. There has been a significant uptick in demand for silicon in recent years, driven by market sectors including automotive, artificial intelligence, cloud computing, and internet of things (IoT) that have their own unique mix of design and implementation requirements. The mobi... » read more