Monolithic Microfluidic Cooling on a Functional CPU Running Real-World Benchmarks


New technical paper titled “Integrated Silicon Microfluidic Cooling of a High-Power Overclocked CPU for Efficient Thermal Management” is published by researchers at Georgia Tech and Microsoft.

According to the abstract:
“In this work, we use micropin-fins etched directly on the back of an Intel Core i7-8700K CPU and overclocked it to dissipate up to 215W of power while being cooled by room temperature de-ionized (DI) water. We demonstrate up to 44.4% reduction in junction-to-inlet thermal resistance while using only 0.3× of volumetric coolant flow per Watt of power dissipated in the CPU compared to a conventional cold-plate. Furthermore, we demonstrate higher sustained core frequencies even when being cooled with elevated inlet temperatures, showing the potential for more efficient datacenter operations without the need for expensive and energy intensive refrigeration loops. The scalability towards heterogeneous 2.5D and 3D devices is also discussed.”

Find the open access technical paper here. Published May 2022.

S. Kochupurackal Rajan, B. Ramakrishnan, H. Alissa, W. Kim, C. Belady and M. S. Bakir, “Integrated Silicon Microfluidic Cooling of a High-Power Overclocked CPU for Efficient Thermal Management,” in IEEE Access, vol. 10, pp. 59259-59269, 2022, doi: 10.1109/ACCESS.2022.3179387.

DRAM Thermal Issues Reach Crisis Point
Increased transistor density and utilization are creating memory performance issues.
Keeping IC Packages Cool
Engineers are finding ways to effectively thermally dissipate heat from complex modules.
Unintended Coupling Issues Grow
More complex and increasingly heterogeneous designs, and multiple dies in a package, increase potential for unwanted interactions.

Leave a Reply

(Note: This name will be displayed publicly)