New technical paper titled "Integrated Silicon Microfluidic Cooling of a High-Power Overclocked CPU for Efficient Thermal Management" is published by researchers at Georgia Tech and Microsoft.
According to the abstract:
"In this work, we use micropin-fins etched directly on the back of an Intel Core i7-8700K CPU and overclocked it to dissipate up to 215W of power while being cooled by room...
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