Frenzy At 10/7nm


The number of chipmakers rushing to 10/7nm is rising, despite a slowdown in Moore's Law scaling and the increased difficulty and cost of developing chips at the most advanced nodes. How long this trend continues remains to be seen. It's likely that 7/5nm will require new manufacturing equipment, tools, materials and transistor structures. Beyond that, there is no industry-accepted roadmap, m... » read more

What Is Spin Torque MRAM?


The memory market is going in several different directions at once. On one front, the traditional memory types, such as DRAM and flash, remain the workhorse technologies. Then, several vendors are readying the next-generation memory types. As part of an ongoing series, Semiconductor Engineering will explore where the new and traditional memory technologies are heading. For this segment, P... » read more

Biz Talk: ASICs


eSilicon CEO [getperson id="11145" comment="Jack Harding"] talks about the future of scaling, advanced packaging, the next big things—automotive, deep learning and virtual reality—and the need for security. [youtube vid=leO8gABABqk]   Related Stories Executive Insight: Jack Harding (Aug 2016) eSilicon’s CEO looks at industry consolidation, competition, China’s impact, an... » read more

Better Chips, Better Cars


There are literally thousands of electronic components in a new car, and those numbers are only going to increase as cars become smarter, safer, greener, and increasingly connected. As automakers and Tier 1 and Tier 2 companies shift their focus from mechanical to a combination of mechanical and electrical, there is an ongoing race among fabless companies to come up with innovative technolog... » read more

What Are FeFETs?


The memory market is going in several different directions at once. On one front, the traditional memory types, such DRAM and flash, remain the workhorse technologies in systems despite undergoing some changes in the business. Then, several vendors are readying the next-generation memory types in the market. As part of an ongoing series, Semiconductor Engineering will explore where the new a... » read more

Transferring Skills Getting Harder


Rising complexity in developing chips at advanced nodes, and an almost perpetual barrage of new engineering challenges at each new node, are making it more difficult for everyone involved to maintain consistent skill levels across a growing number of interrelated technologies. The result is that engineers are being forced to specialize, but when they work with other engineers with different ... » read more

Moore’s Law Debate Continues


Does shrinking devices still make sense from a cost and performance perspective? The answer isn’t so simple anymore. Still, the discussion as to whether semiconductors are still on track with [getkc id="74" comment="Moore's Law"] occurs on a frequent enough basis to continue analyzing at least some of the dynamics at play. There is much speculation about what happens after 7nm, as well as ... » read more

Tech Talk: Embedded Memories


Dave Eggleston, vice president of embedded memory at GlobalFoundries, talks about the pros and cons of new types of embedded memory, including which work best for certain applications and with various advanced packaging options. [youtube vid=7D9zoA9FFIw] » read more

To 10nm And Beyond


Hong Hao, senior vice president of the foundry business at Samsung Semiconductor, sat down with Semiconductor Engineering to discuss the future direction of transistors, process technology, lithography and other topics. What follows are excerpts of those conversations. SE: Samsung recently rolled out its 10nm finFET technology. It appears that Samsung is the world’s first company to ship 1... » read more

What’s Important For IoT—Power, Performance Or Integration?


Semiconductor Engineering sat down with Steve Hardin, director of product development for AT&T's IoT Solutions Group; Wayne Dai, CEO of VeriSilicon; John Koeter, vice president of the Solutions Group at [getentity id="22035" e_name="Synopsys"]; and Rajeev Rajan, vice president for IoT at [getentity id="22819" comment="GlobalFoundries"]. What follows are excerpts of that conversation. To vie... » read more

← Older posts