tag: 5G

5G NR Design eMBB
By Cadence - 27 Jan, 2021 - Comments: 0

Next-generation 5G/6G communication systems will provide massive connectivity to the internet with extreme capacity, coverage, reliability, and ultra-low latency, enabling a wide range of new services made possible through innovative technologies. Enhanced mobile broadband (eMBB) extends the current mobile experience with high data throughput on the order of more than 10Gbps, high system capaci... » read more

Fearless Chip Forecasts For 2021
By Mark LaPedus - 21 Jan, 2021 - Comments: 0

It’s been a roller coaster ride in the semiconductor industry. In early 2020, the semiconductor business looked bright, but then the Covid-19 pandemic struck, causing a sudden downturn. By mid-2020, though, the market bounced back, as the stay-at-home economy drove demand for computers, tablets and TVs. The chip market ended on a high note in 2020, but the question is, what’s in store fo... » read more

The Chip Industry’s Next-Gen Roadmap
By Mark LaPedus - 21 Jan, 2021 - Comments: 1

Todd Younkin, the new president and chief executive of the Semiconductor Research Corp. (SRC), sat down with Semiconductor Engineering to talk about engineering careers, R&D trends and what’s ahead for chip technologies over the next decade. What follows are excerpts of that conversation. SE: As a U.S.-based chip consortium, what is SRC's charter? Younkin: The Semiconductor Research... » read more

Car Industry Changing Under The Hood
By Ann Mutschler - 07 Jan, 2021 - Comments: 0

After an initial burst of autonomous activity, the automotive ecosystem regrouped, re-evaluated its goals, and is now ready to begin deploying new technologies made possible by modern development approaches and forward-looking vehicle architectures. The pandemic hurt vehicle sales in 2020, but it also gave the OEMs a chance to catch their breath. Panic over announcements from other carmakers... » read more

The Impact Of 5G On Silicon Design
By Ron Lowman - 07 Jan, 2021 - Comments: 0

5G, the next-generation of mobile broadband, is driving tremendous increases in data throughput for mobile applications by introducing carrier aggregation, massive MIMO, advanced modulation, and high bandwidth channels in the mmWave spectrum. However, 5G and its governing body, 3GPP, has very high expectations to expand its capabilities well beyond the mobile market, and move into many new area... » read more

CEO Outlook: 2021
By Ed Sperling - 04 Jan, 2021 - Comments: 0

The new year will be one of significant transition and innovation for the chip industry, but there are so many new applications and market segments that broad generalizations are becoming less meaningful. Unlike in years past, where sales of computers or smart phones were a good indication of how the chip industry would fare, end markets have both multiplied and splintered, greatly increasin... » read more

How 5G Is Influencing Silicon Design
By Synopsys - 21 Dec, 2020 - Comments: 0

5G is introducing a wide array of challenges in next-generation SoCs that go well beyond high bandwidth wireless. These include increasing system bandwidth, lowering SoC latency, and reducing power significantly for the connected internet of things. Using trusted standards-based IP and proven processing and analog IP at the most aggressive process technology nodes is needed to bring 5G to marke... » read more

Regaining U.S. Chip Competitiveness
By Mark LaPedus - 17 Dec, 2020 - Comments: 0

In the IC industry, companies compete in a multitude of different markets. At the same time, there is competition among nations on several different fronts. In technology, for example, various nations are competing for supremacy in 5G, AI and quantum computing. China has rekindled the worldwide competition in semiconductors. Backed by $150 billion in funding, the country is developing its do... » read more

200mm Demand Surges
By Mark LaPedus - 17 Dec, 2020 - Comments: 1

A surge in demand for various chips is causing shortages for select 200mm foundry capacity as well as 200mm fab equipment, and it shows no signs of abating in 2021. Foundry customers will face a shortfall of 200mm capacity at select foundries at least in the first half of 2021, and perhaps beyond. Those customers will need to plan ahead to ensure they obtain enough 200mm capacity in 2021. Ot... » read more

A Production-Worthy Fan-Out Solution — ASE FOCoS Chip Last
By ASE - 16 Dec, 2020 - Comments: 0

The 5th Generation (5G) wireless systems popularity will push the package development into a high performance and heterogeneous integration form. For high I/O density and high performance packages, the promising Fan Out Chip on Substrate (FOCoS) provides a solution to match outsourced semiconductor assembly and testing (OSAT) capability. FOCoS is identified the Fan Out (FO) package, which can f... » read more

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