tag: 5G

DRAM, 3D NAND Face New Challenges
By Mark LaPedus - 21 Sep, 2020 - Comments: 1

It’s been a topsy-turvy period for the memory market, and it's not over. So far in 2020, demand has been slightly better than expected for the two main memory types — 3D NAND and DRAM. But now there is some uncertainty in the market amid a slowdown, inventory issues and an ongoing trade war. In addition, the 3D NAND market is moving toward a new technology generation, but some are enc... » read more

AI & IP In Edge Computing For Faster 5G And The IoT
By Ron Lowman - 10 Sep, 2020 - Comments: 0

Edge computing, which is the concept of processing and analyzing data in servers closer to the applications they serve, is growing in popularity and opening new markets for established telecom providers, semiconductor startups, and new software ecosystems. It’s brilliant how technology has come together over the last several decades to enable this new space starting with Big Data and the idea... » read more

New Data Format Boosts Test Analytics
By Anne Meixner - 08 Sep, 2020 - Comments: 0

Demand for more and better data for test is driving a major standards effort, paving the way for one of most significant changes in data formats in years. There is good reason for this shift. Data from device testing is becoming a critical element in test program decisions regarding limits and flows. This is true for everything from automotive and medical components to complex, heterogeneous... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 28 Aug, 2020 - Comments: 0

Trade As reported, the U.S. recently implemented more restrictions on U.S. chip sales to Huawei. In response, SEMI has released the following statement in response to the new export control rule changes announced by the U.S. Commerce Department: “SEMI recognizes the role of export control measures to address threats to U.S. national security. However, we are very concerned the new export ... » read more

RISC-V’s Expanding Footprint
By Ed Sperling - 27 Aug, 2020 - Comments: 0

Zdenek Prikryl, CTO of Codasip, sat down with Semiconductor Engineering to talk about the RISC-V market, where this open instruction set architecture (ISA) is gaining ground, and what are the biggest challenges in working with this technology. SE: Where do you see the value in RISC-V? Is it for off-the-shelf processors or more customized components? Prikryl: A few years ago, RISC-V was us... » read more

Power Amp Wars Begin For 5G
By Mark LaPedus - 24 Aug, 2020 - Comments: 2

Demand is increasing for power amplifier chips and other RF devices for 5G base stations, setting the stage for a showdown among different companies and technologies. The power amplifier device is a key component that boosts the RF power signals in base stations. It's based on two competitive technologies, silicon-based LDMOS or RF gallium nitride (GaN). GaN, a III-V technology, outperforms ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 21 Aug, 2020 - Comments: 0

Packaging Chunghwa Telecom, ASE and Qualcomm Technologies have announced plans to jointly build Taiwan's first 5G mmWave enterprise private network smart factory. As part of the plan, ASE is deploying a series of smart factory technologies within its existing Kaohsiung, Taiwan-based campus. This includes the deployment of 5G mmWave network cells in the Kaohsiung campus. Qualcomm will be ... » read more

What’s Next For Semis?
By Mark LaPedus - 20 Aug, 2020 - Comments: 0

It’s been a turbulent year in the semiconductor industry. 2020 was supposed to be a strong year. Then, the coronavirus outbreak hit. Suddenly, a large percentage of countries implemented various measures to mitigate the outbreak, such as stay-at-home orders as well as business and store closures. Economic turmoil and job losses soon followed, not to mention the human tragedy involved. M... » read more

Huawei: 5G Is About Capacity, Not Speed
By Ed Sperling - 18 Aug, 2020 - Comments: 3

Paul Scanlan, CTO of the Huawei Carrier Business Group in Huawei Technologies, sat down with Semiconductor Engineering to talk about 5G, which use cases are attractive and why, and how that compares with previous wireless technologies. SE: Where are you seeing 5G, and how do you see this rolling out both for sub-6GHz and millimeter wave? Scanlan: 5G is a platform for transformation. The f... » read more

Power/Performance Bits: Aug. 18
By Jesse Allen - 18 Aug, 2020 - Comments: 0

Flexible, hole-filled films Researchers from Daegu Gyeongbuk Institute of Science and Technology (DGIST) and Hongik University propose a simple way to make flexible electrodes and thin film transistors last longer: adding lots of tiny holes. A major problem with flexible electronics is the formation of microscopic cracks after repeated bending which can cause the device to lose its conducti... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy