How to Manage One Trillion Devices on the Edge


THE EDGE, THE DATACENTER, AND NEW DESIGN PRINCIPLES: The world of compute is changing rapidly, as is the traditional view of a physical building, or buildings filled with servers, storage, and networking to “run the business”. Cloud computing, distributed cloud computing, and edge computing will all be fed by a 5G access network, forcing IT organizations to think and plan differently. Th... » read more

Testing In Context Gaining Ground


Testing in context is beginning to gain wider appeal as chip complexity increases, and as ICs are deployed in more safety-critical and mission-critical applications. While design in context has been the norm for SoCs for some time, a similar approach in test has been slow going. Cell-aware testing technology was first described a decade ago, and since then its adoption has been modest. But w... » read more

Cadence To Buy NI’s AWR Unit For $160M


Cadence signed a deal to buy National Instruments' AWR business unit for about $160 million in cash, a move that Cadence describes as a way to broaden its market into intelligent system design. AWR's strength is high-frequency RF design automation tools, particularly in the millimeter wave and microwave spectrums, which are critical for radar and 5G. Both of those technologies are expected t... » read more

Week In Review: Manufacturing, Test


Packaging and test TrendForce has released its top-10 OSAT rankings in terms of sales for the third quarter of 2019. ASE was in first place in the rankings, followed by Amkor and JCET. “According to the latest research from TrendForce, the decline in the global OSAT industry showed signs of a gradual halt in 3Q19, since the drop in memory prices began to slow down, and smartphone sales stead... » read more

Thoroughly Verifying Complex SoCs


The number of things that can go wrong in complex SoCs targeted at leading-edge applications is staggering, and there is no indication that verifying these chips will function as expected is going to get any easier. Heterogeneous designs developed for leading-edge applications, such as 5G, IoT, automotive and AI, are now complex systems in their own right. But they also need to work in conju... » read more

Electromagnetic Challenges In High-Speed Designs


ANSYS’ Anand Raman, senior director, and Nermin Selimovic, product sales specialist, talk with Semiconductor Engineering about how to deal with rising complexity and tighter tolerances in AI, 5G, high-speed SerDes and other chips developed at the latest process nodes where the emphasis is on high performance and low power. » read more

RF GaN Gains Steam


Wide-bandgap semiconductors are hot topics these days. One wide-bandgap semi type--silicon carbide (SiC)--is the talk of the town and is gaining steam in electric vehicles and other systems. But let’s not forget about gallium nitride (GaN). GaN, a binary III-V material, has 10 times the breakdown field strength with double the electron mobility than silicon. GaN is used for LEDs, power ... » read more

Week In Review: Manufacturing, Test


Market research Smartphone shipments in China stood at 98.9 million units in the third quarter of 2019, down 3.6% year-on-year, according to IDC. Of that, 5G phone shipments in China have grown from virtually zero not long ago to 485,000 units in the third quarter of 2019, according to IDC. Vendors shipped devices amid the launch of commercial 5G services in October. The early smartphone le... » read more

Should We Even Be Talking About 6G?


Friends and coworkers have been sending me a lot of articles lately about 6G, with snappy headlines that seem to suggest that 5G is already a thing of the past. As a marketing manager working on cellular technology, they want to know what I think. On the one hand, I’m excited to see that the hype surrounding 5G is shining a spotlight on wireless communications research and that visionaries ar... » read more

Simplifying Silicon Bring-Up And Debug On ATE equipment With ATE-Connect


The silicon bring-up process is ripe for improvement. Tessent SiliconInsight with ATE-Connect technology eliminates communication barriers between proprietary tester-specific software and DFT platforms, which accelerates debug of IJTAG devices, speeds product ramps, and reduces time-to-market for products in 5G wireless communications, autonomous driving, and artificial intelligence. Read mo... » read more

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