New Architecture Elements For 5G RF Front-End Modules To Reduce Noise, Improve Efficiency, And Allow Multiple Radio Transmitters


A technical paper titled “Circuits for 5G RF front-end modules” was published by researchers at Skyworks Solutions Inc. Abstract: "Worldwide adoption of fourth-generation wireless (4G) long-term evolution (LTE) smartphones and the actual transition to fifth-generation wireless (5G) is the main driving engine for semiconductor industry. 5G is expected to reach high data rate speeds (1 Gbps... » read more

Using Generative AI To Connect Lab To Fab Test


Executive Insight: Thomas Benjamin, CTO at National Instruments, sat down with Semiconductor Engineering to discuss a new way of looking at test, using data as a starting point and generative AI as a bridge between different capabilities. SE: What are the big changes you're seeing and how is that affecting movement of critical data from the lab to the fab? Benjamin: If you walk into any m... » read more

Week In Review: Design, Low Power


Qualcomm, NXP, Infineon, Nordic, and Bosch are jointly investing in a new RISC-V company, to be formed in Germany, that will speed up RISC-V’s adoption in commercial products. The company will be “a single source to enable compatible RISC-V based products, provide reference architectures, and help establish solutions widely used in the industry,” according to a press release. The co... » read more

New Approaches To Sensors And Sensing


Sensors are becoming more intelligent, more complex, and much more useful. They are being integrated with other sensors in sensor fusion, so a smart doorbell may only wake up when it’s imperative to see who’s at the door, and a microphone may only send alerts when there are cries for help or sounds of glass breaking. Kim Lee, senior director of system applications engineering at Infineon, t... » read more

Implementing Fast Barriers For A Shared-Memory Cluster Of 1024 RISC-V Cores


A technical paper titled “Fast Shared-Memory Barrier Synchronization for a 1024-Cores RISC-V Many-Core Cluster” was published by researchers at ETH Zürich and Università di Bologna. "Synchronization is likely the most critical performance killer in shared-memory parallel programs. With the rise of multi-core and many-core processors, the relative impact on performance and energy overhe... » read more

Solving 5G And 6G Challenges With Artificial Intelligence


Wireless networks are inherently complex, generate massive amounts of data, and have grown in complexity with each new generation of technology. This combination of large data sets and complexity makes wireless networks an ideal candidate for AI. People are receiving first-hand experiences of the power and potential of deep neural networks and machine learning (ML) as the technology begins t... » read more

Demand For Timing Innovation Grows


The semiconductor industry has begun exploring a range of timing options as demand for increased performance and more features exceeds the ability to design chips using the same techniques and technology that have been relied on for decades. Like many elements in computing, timing is a hierarchy or stack. It includes everything from partitioning AI computations into multiple parts and assemb... » read more

L31 Embedded Core Extensions For Wireless And Connectivity


5G is the latest generation of cellular networks using the 3rd Generation Partnership Project (3GPP) 5G New Radio air interface. Unlike previous generations of network (2G, 3G & 4G), which had a one-size-fits-all approach, 5G aims to address a wide range of very different applications. To flexibly support diverse quality of service requirements, network slicing is introduced to enable multip... » read more

Preparing For 5G Millimeter Wave And 6G


Cellular technology is about to take a giant leap forward, but the packaging, assembly, and testing of the chips used in 5G millimeter wave and the forthcoming 6G ecosystem will be significantly more complicated than anything used in the past. So far, most 5G devices are still working at sub-6 GHz frequencies. A massive rollout of mmWave technology over the next few years will significantly ... » read more

From Lab To Fab: Increasing Pressure To Fuse IC Processes


Test, metrology, and inspection are essential for both the lab and the fab, but fusing them together so that data created in one is easily transferred to the other is a massive challenge. The chip industry has been striving to bridge these separate worlds for years, but the economics, speed, and complexity of change require a new approach. The never-ending push toward smaller, better-defined... » read more

← Older posts Newer posts →