tag: AMD

Week In Review: Design, Low Power
By Jesse Allen - 26 Feb, 2021 - Comments: 0

Cadence completed the acquisition of NUMECA International, a provider of computational fluid dynamics (CFD), mesh generation, multi-physics simulation, and optimization solutions for industries including aerospace, automotive, industrial, and marine. Founded in 1993 as a spin-off of the Vrije Universiteit Brussel (VUB), NUMECA was based in Brussels, Belgium. Terms of the deal were not disclosed... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 12 Feb, 2021 - Comments: 0

Automotive/Mobility With the chip supply so tight it is shutting down automotive production lines, U.S. chip company CEOs signed a Semiconductor Industry Association (SIA) letter asking the U.S. president to include funding incentives for the chip manufacturing in U.S. economic recovery plans. The letter references the CHIPS for America Act and asks the president to work with Congress to suppo... » read more

Week In Review: Design, Low Power
By Jesse Allen - 15 Jan, 2021 - Comments: 0

Qualcomm will acquire data center chip startup Nuvia for approximately $1.4 billion. Nuvia is working on a data center SoC and Arm-based CPU core it claims will lower performance per total cost of ownership by matching high performance with high efficiency and limiting maximum power to that which can be dissipated in an air-cooled environment. Qualcomm said Nuvia's technology would be incorpora... » read more

Realize A More Productive EDA Environment From HPE With AMD
By Ansys - 13 Jan, 2021 - Comments: 0

Few industries are more competitive than modern electronics manufacturing and chip design. Consumers expect devices to be faster, cheaper, and more reliable with each generation. Whether large or small, electronics manufacturers rely on electronic design automation (EDA) to enable these improvements. Click here to access the white paper. » read more

Using Analytics To Reduce Burn-in
By Anne Meixner - 12 Jan, 2021 - Comments: 3

Silicon providers are using adaptive test flows to reduce burn-in costs, one of the many approaches aimed at stemming cost increases at advanced nodes and in advanced packages. No one likes it when their cell phone fails within the first month of ownership. But the problems are much more pressing when the key components in data warehouse servers or automobiles fail. Reliability expectations ... » read more

Week In Review: Design, Low Power
By Jesse Allen - 08 Jan, 2021 - Comments: 1

FPGA and eFPGA company Achronix is going public on Nasdaq via a merger with special-purpose acquisition company ACE Convergence Acquisition Corp. (Nasdaq: ACEV). Upon closing of the transaction, the combined operating entity retain the name Achronix Semiconductor Corporation and will be listed under the ticker symbol ACHX. According to Achronix, the transaction reflects an implied equity value ... » read more

CEO Outlook: 2021
By Ed Sperling - 04 Jan, 2021 - Comments: 0

The new year will be one of significant transition and innovation for the chip industry, but there are so many new applications and market segments that broad generalizations are becoming less meaningful. Unlike in years past, where sales of computers or smart phones were a good indication of how the chip industry would fare, end markets have both multiplied and splintered, greatly increasin... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 31 Dec, 2020 - Comments: 0

Chipmakers and OEMs Third Point, a hedge fund, released a letter, saying that Intel needs to explore its strategic alternatives. This includes the breakup of the chip giant. Obtained by Yahoo and others, the letter says Intel needs to decide “whether Intel should remain an integrated device manufacturer” and should divest certain failed acquisitions. Here’s another analysis of the sit... » read more

Manufacturing Bits: Dec. 29
By Mark LaPedus - 29 Dec, 2020 - Comments: 1

Chiplet-based exascale computers At the recent IEEE International Electron Devices Meeting (IEDM), CEA-Leti presented a paper on a 3D chiplet technology that enables exascale-level computing systems. The United States and other nations are working on exascale supercomputers. Today’s supercomputers are measured in floating point operations per second. The world’s fastest supercomputers c... » read more

Variation Threat In Advanced Nodes, Packages Grows
By Ed Sperling - 21 Dec, 2020 - Comments: 0

Variation is becoming a much bigger and more complex problem for chipmakers as they push to the next process nodes or into increasingly dense advanced packages, raising concerns about the functionality and reliability of individual devices, and even entire systems. In the past, almost all concerns about variation focused on the manufacturing process. What printed on a piece of silicon didn't... » read more

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