EDA Tools For Quantum Chips

By Marie C. Baca - 22 Nov, 2022 - Comments: 0

Commercially viable quantum computers are at least several years away, but some researchers already are questioning whether existing EDA tools will be sufficient for designing quantum chips and systems. That’s because quantum design requirements at times transcend classical rules about materials, temperature, and structure — rules that are foundational for the majority of EDA products on th... » read more

Wall Street View Of EDA Industry

By Bob Smith - 17 Nov, 2022 - Comments: 0

Jay Vleeschhouwer, managing director of Griffin Securities, has followed the electronic design automation (EDA) industry as a leading financial analyst for 25 years and is a popular speaker at the annual Design Automation Conference (DAC). I spoke with Vleeschhouwer after attending his presentation "The State of EDA: A View from Wall Street" at this year’s DAC. Bob Smith: According t... » read more

Balancing Power And Heat In Advanced Chip Designs

By Karen Heyman - 10 Nov, 2022 - Comments: 1

Power and heat use to be someone else's problem. That's no longer the case, and the issues are spreading as more designs migrate to more advanced process nodes and different types of advanced packaging. There are a number of reasons for this shift. To begin with, there are shrinking wire diameters, thinner dielectrics, and thinner substrates. The scaling of wires requires more energy to driv... » read more

Week In Review: Design, Low Power

By Marie C. Baca - 04 Nov, 2022 - Comments: 0

Earnings and Acquisitions Siemens will acquire Avery Design Systems, a simulation-independent verification IP supplier, in the first quarter of fiscal year 2023. The terms of the transaction were not disclosed. Siemens executives say the acquisition will “enhance Siemens’ offerings across mainstream verification IP segments, while further extending Siemens verification solutions into area... » read more

Week In Review: Design, Low Power

By Marie C. Baca - 28 Oct, 2022 - Comments: 0

Tools and IP Scandinavian researchers used a laser-powered chip to transmit about 1.84 petabytes of data over a fiber optic cable in one second. The scientists said the technology could lead to faster broadband speeds and reduce the amount of energy used to keep the internet running. Imec said the semiconductor industry is likely to see increasing separation of power delivery and signal rou... » read more

Considering The Power Of The Cloud For EDA

By Michael White - 27 Oct, 2022 - Comments: 0

By Michael White, Siemens EDA, in technical collaboration with Peeyush Tugnawat, Google Cloud, and Philip Steinke, AMD At DAC 2022, Google Cloud, AMD, and Calibre Design Solutions presented an EDA in the cloud solution that enables companies to access virtually unlimited compute resources when and as needed to optimize their design and verification flows. If your company is considering addin... » read more

AI-Driven Big Data Analytics Enables Actionable Intelligence, Improving SoC Design Productivity

By Cadence - 26 Oct, 2022 - Comments: 0

As the latest systems on chip (SoCs) grow in size and complexity, a vast amount of design data is generated during verification and implementation. Design data is business critical and, with the proliferation of artificial intelligence (AI) use in chip design, provides designers an opportunity to carry forward learnings and insights with every new design. To achieve first-pass success deliverin... » read more

EDA, IP Revenue Way Up

By Ed Sperling - 17 Oct, 2022 - Comments: 0

EDA and semiconductor IP sales grew 17.5% to $3.75 billion in Q2, the highest growth in more than a decade, fueled by more complex designs and the need for advanced design and verification tools. Demand for nearly every segment tracked in SEMI's Electronic Design Market Data (EDMD) report was up, including services, which grew 23.2% in Q2 — the most recent statistics available in. That cou... » read more

EVs Raise Energy, Power, And Thermal IC Design Challenges

By Ann Mutschler - 06 Oct, 2022 - Comments: 0

The transition to electric vehicles is putting pressure on power grids to produce more energy and on vehicles to use that energy much more efficiently, creating a gargantuan set of challenges that will affect every segment of the automotive world, the infrastructure that supports it, and the chips that are required to make all of this work. From a semiconductor standpoint, improvements in th... » read more

IC Architectures Shift As OEMs Narrow Their Focus

By Ed Sperling - 03 Oct, 2022 - Comments: 0

Diminishing returns from process scaling, coupled with pervasive connectedness and an exponential increase in data, are driving broad changes in how chips are designed, what they're expected to do, and how quickly they're supposed to do it. In the past, tradeoffs between performance, power, and cost were defined mostly by large OEMs within the confines of an industry-wide scaling roadmap. Ch... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: EDA

EDA Tools For Quantum Chips

Wall Street View Of EDA Industry

Balancing Power And Heat In Advanced Chip Designs

Week In Review: Design, Low Power

Week In Review: Design, Low Power

Considering The Power Of The Cloud For EDA

AI-Driven Big Data Analytics Enables Actionable Intelligence, Improving SoC Design Productivity

EDA, IP Revenue Way Up

EVs Raise Energy, Power, And Thermal IC Design Challenges

IC Architectures Shift As OEMs Narrow Their Focus