What Future Processors Will Look Like

By Ed Sperling - 13 Jul, 2022 - Comments: 0

Mark Papermaster, CTO at AMD, sat down with Semiconductor Engineering to talk about architectural changes that are required as the benefits of scaling decrease, including chiplets, new standards for heterogeneous integration, and different types of memory. What follows are excerpts of that conversation. SE: What does a processor look like in five years? Is it a bunch of chips in a package? I... » read more

Risks Rise As Robotic Surgery Goes Mainstream

By John Koon - 30 Jun, 2022 - Comments: 1

As robotic-assisted surgery moves into the mainstream, so do concerns about security breaches, latency, and system performance. In the operating room, every second is critical, and technology failures or delays can be life-threatening. Robotic-assisted surgery (RAS) has around for a couple decades, but it is becoming more prevalent and significantly more complex. The technology often include... » read more

EDA Gaps At The Leading Edge

By Ed Sperling - 29 Jun, 2022 - Comments: 1

Semiconductor Engineering sat down to discuss why new approaches are required for heterogeneous designs, with Bari Biswas, senior vice president for the Silicon Realization Group at Synopsys; John Lee, general manager and vice president of the Ansys Semiconductor business unit; Michael Jackson, corporate vice president for R&D at Cadence; Prashant Varshney, head of product for Microsoft Azu... » read more

Toward Democratized IC Design And Customized Computing

By Jason Cong - 28 Jun, 2022 - Comments: 0

Integrated circuit (IC) design is often considered a “black art,” restricted to only those with advanced degrees or years of training in electrical engineering. Given that the semiconductor industry is struggling to expand its workforce, IC design must be rendered more accessible. The benefit of customized computing General-purpose computers are widely used, but their performance improv... » read more

A New Breed Of EDA Required

By Brian Bailey - 23 Jun, 2022 - Comments: 1

While doing research for one of my stories this month, a couple of people basically said that applying methodologies of the past to the designs of today can be problematic because there are fundamental differences in the architectures and workloads. While I completely agree, I don't think these statements go far enough. Designs of today generally have one of everything — one CPU, one accel... » read more

EDA Embraces Big Data Amid Talent Crunch

By Marie C. Baca - 23 Jun, 2022 - Comments: 0

The semiconductor industry’s labor crunch finally has convinced chip designers to bet big money on big data. As recently as 2016, executives weren’t sure there was a market for big data approaches to electronic design automation. The following year, utilization of big data remained stuck in its infancy. And in 2018, Semiconductor Engineering questioned why the EDA sector wasn’t investi... » read more

Coverage-Directed Test Selection Method for Automatic Test Biasing During Simulation-Based Verification

By Technical Paper Link - 22 Jun, 2022 - Comments: 0

New research paper titled "Supervised Learning for Coverage-Directed Test Selection in Simulation-Based Verification" from researchers at University of Bristol and Infineon Technologies. Abstract: "Constrained random test generation is one the most widely adopted methods for generating stimuli for simulation-based verification. Randomness leads to test diversity, but tests tend to repeate... » read more

Will Big Competition Attract More Talent For IC Companies?

By Marie C. Baca - 26 May, 2022 - Comments: 1

Google is hiring a chip packaging technologist. General Motors is seeking a wafer fabrication procurement specialist. Facebook Reality Labs wants a materials researcher with experience in photolithography and nanoimprint techniques. Recent job postings by tech and automotive giants are enough to worry any chip company executive struggling to attract talent. But what may seem at first like a ... » read more

Bridging IC Design, Manufacturing, And In-Field Reliability

By Ed Sperling - 18 May, 2022 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk about silicon lifecycle management and how that can potentially glue together design, manufacturing, and devices in the field, with Prashant Goteti, principal engineer at Intel; Rob Aitken, R&D fellow at Arm; Zoe Conroy, principal hardware engineer at Cisco; Subhasish Mitra, professor of electrical engineering and computer sci... » read more

The Challenge Of Optimizing Chip Architectures For Workloads

By Brian Bailey - 12 May, 2022 - Comments: 1

It isn't possible to optimize a workload running on a system just by looking at hardware or software separately. They need to be developed together and intricately intertwined, an engineering feat that also requires bridging two worlds with have a long history of operating independently. In the early days of computing, hardware and software were designed and built by completely separate team... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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