tag: IBM

New Machine Tops The Green500 List
By Barry Pangrle - 10 Dec, 2014 - Comments: 0

The Green500 has released its latest list of the top 500 most energy efficient Supercomputers and there is a new machine, L-CSC from the Helmholtz Center that is the first supercomputer to surpass the 5 GigaFLOPS/watt barrier. The machine is yet another heterogeneous system and is based on AMD FirePro S9150 GPU accelerators and Intel Xeon E5-2690v2 10C 3GHz processors. IBM and NVIDIA aren’... » read more

Manufacturing Bits: Dec. 2
By Mark LaPedus - 02 Dec, 2014 - Comments: 0

Storage ring EUV source Needless to say, extreme ultraviolet (EUV) lithography is delayed. Chipmakers hope to insert EUV at the 7nm node, but that’s not a given. As before, the big problem is the EUV light source. So far, the source can’t generate enough power to enable the required throughput for EUV in mass production. Researchers at the SLAC National Accelerator Laboratory have one p... » read more

Hybrid Memory Cube – Ready For Prime Time
By Manohar Ayyagiri - 20 Nov, 2014 - Comments: 0

With the release this week of Hybrid Memory Cube (HMC) 2.0, designers can get their hands on mature, standards-based IP that can be used to significantly scale the performance of servers and data centers. HMC offers bandwidths up to 320 GB/s – 12X that of standard memory solutions like DDR4 – while consuming significantly less power. These benefits are too significant to ignore for ASIC, So... » read more

An Inside Look At The GlobalFoundries-IBM Deal
By Ed Sperling - 20 Nov, 2014 - Comments: 3

GlobalFoundries' proposed acquisition of IBM Microelectronics is the kind of deal that will have business schools talking for many years to come—a gargantuan combination of expertise and technology, built on the back of high-profile business successes and failures, long-running legal struggles and global politics—with far-reaching implications for all parts of the semiconductor supply chain... » read more

Transistor Options Narrow For 7nm
By Mark LaPedus - 13 Nov, 2014 - Comments: 0

Chipmakers are currently ramping up silicon-based finFETs at the 16nm/14nm node, with plans to scale the same technology to 10nm. Now, the industry is focusing on the transistor options for 7nm and beyond. At one time, the leading contenders involved several next-generation transistor types. At present, the industry is narrowing down the options and one technology is taking a surprising lea... » read more

RF SOI Foundry Biz Heats Up
By Mark LaPedus - 13 Nov, 2014 - Comments: 0

The foundry business is undergoing a new round of acquisition and fab expansion activity. As before, the big foundry vendors are getting bigger, while some may fall by the wayside. And at times, the events cause some uncertainty, if not jitters, in the supply chain. For example, [getentity id="22819" comment="GlobalFoundries"]in October signed a definitive agreement to acquire the chip uni... » read more

Will Materials Derail Moore’s Law?
By Mark LaPedus - 13 Nov, 2014 - Comments: 0

Is Moore’s Law slowing down? Clearly, chipmakers are struggling to keep up with Moore’s Law these days. But one sometimes forgotten and critical technology could easily derail Moore’s Law--materials. In fact, the cost and complexity for electronic materials are increasing at each node. “Chemical and gas commodity procurement spends are growing rapidly due to process complexity and un... » read more

A Decade At The Ceiling
By Barry Pangrle - 05 Nov, 2014 - Comments: 0

This month marks the tenth anniversary of the introduction of the Intel Pentium 4 HT 570J, which had an advertised operating frequency of 3.8 GHz. It was manufactured in a 90nm process, had a VID voltage range of 1.2V-1.425V and was rated at 115W TDP. In a previous article, Power to Fly, we looked at the graph that I’m including again here below for reference. The microprocessor indu... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 31 Oct, 2014 - Comments: 0

STMicroelectronics announced mixed results for the quarter. The company also launched a plan to cut $100 million in costs. As part of the plan, it is reviewing the implications to its process technology efforts following the recent announcements by its research alliance partners, namely IBM. STMicro is one of the main drivers of FDSOI technology. The company’s FDSOI partner is IBM, which is s... » read more

Applied-TEL Deal Faces Delays
By Mark LaPedus - 29 Oct, 2014 - Comments: 1

Applied Materials’ proposed move to acquire rival Tokyo Electron Ltd. (TEL) faces a possible delay. The blockbuster deal could get pushed out until next year amid a host of complicated regulatory issues. As reported in September of 2013, Applied Materials announced a definitive agreement to acquire TEL in a stock deal valued at around $9.3 billion. Under the terms, Applied Materials would ... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy