tag: IBM

Power And Performance: GSS Sees SOI Advantages For FinFETs
By Various Writers - 17 Sep, 2012 - Comments: 0

Are FinFETs better on SOI? In a series of papers, high-profile blogs and subsequent media coverage,Gold Standard Simulations (aka GSS) has indicated that, yes, FinFETs should indeed be better on SOI. To those of us not deeply involved in the research world, much of this may seem to come out of nowhere.  But there’s a lot of history here, and in this blog we’ll take a look at what it’s... » read more

Keeping The Balance
By Ed Sperling - 13 Sep, 2012 - Comments: 0

By Ann Steffora Mutschler The brains of datacenters today are more powerful than ever due to technology advancements in chip architectures and in manufacturing processes that allow more processing power thanks to Moore’s Law. But knowing exactly how and where to configure the processors and cores for optimum throughput and performance within a certain power budget raises a number of qu... » read more

The Limits Of Virtualization
By Ed Sperling - 13 Sep, 2012 - Comments: 0

By Ed Sperling The future of virtualization in the corporate data center is firmly established, but questions about the value of virtualization beyond that world remain as fuzzy as the future of many-core systems. While there is no theoretical limit to how many cores can be added into SoCs, there is very little progress in developing applications that can take advantage of all of those core... » read more

Speed Sells
By Ed Sperling - 13 Sep, 2012 - Comments: 0

The good news is that the new iPhone battery lasts at least as long as the old one. The bad news is that Apple hasn’t offered double battery life and equivalent performance as an option for mobile users that need extended times between charges. They’re not alone, of course. At the Intel Developer Forum this week, Intel Chief Product Officer Dadi Perlmutter talked about voice and gesture-... » read more

Modeling the Future
By Ann Mutschler - 13 Sep, 2012 - Comments: 0

Every once in a while I read through the employment listings as part of the Semiconductor Manufacturing group on LinkedIn because I find it fascinating to see what employers are looking for even if I am not applying. Particularly for verification engineering position, one of the job responsibilities typically includes development of the architecture for a functional verification environment ... » read more

IBM’s Power7+ Processor
By Barry Pangrle - 12 Sep, 2012 - Comments: 0

By Barry Pangrle Hot Chips 24 was held Aug. 27-29 with tutorials on the first day and 30-minute technical presentations plus keynote addresses on the second and third days. There were a lot of great presentations and Hot Chips is definitely one of my favorite conferences. So out of all of the presentations, why did I choose IBM’s Scott Taylor’s on Power7+? Well, it’s likely that I’l... » read more

Ivy Bridge Settles Old Bet
By Marc David Levenson - 16 Aug, 2012 - Comments: 0

Think back seven years to 2005. Those were boom times with the housing market rising, the dollar high, 65nm node chips on the horizon and EUV the great future lithography hope. EUVL was late for the next (45nm) node, but a great new idea had appeared to fill the gap—water immersion scanning with 193nm exposure! But how far could wet 193nm lithography go before EUVL or some new thing, such as ... » read more

What Comes After FinFETs?
By Ed Sperling - 16 Aug, 2012 - Comments: 0

By Mark LaPedus The semiconductor industry is currently making a major transition from conventional planar transistors to finFETs starting at 22nm. The question is what’s next? In the lab, IBM, Intel and others have demonstrated the ability to scale finFETs down to 5nm or so. If or when finFETs runs out of steam, there are no less than 18 different next-generation candidates that could o... » read more

G450C To Align Vendors During 450mm Transition
By Ed Sperling - 16 Aug, 2012 - Comments: 0

By David Lammers Innovation and synchronization among multiple companies do not often go hand in hand. But for the 450mm wafer transition to provide its full benefits, chip makers and their suppliers will need to do more than a simple wafer size scale up. That may lead the Global 450 Consortium (G450C) to serve as the proving ground for efforts to more closely match the electrical results o... » read more

The Easy Stuff Is Over
By Ed Sperling - 09 Aug, 2012 - Comments: 0

By Ed Sperling Doomsayers have been predicting the end of Moore’s Law for the better part of a decade. While it appears that it will still remain viable for some companies—Intel and IBM already are looking into single digits of nanometers and researchers speculating about picometer designs—for most companies the race is over. Progress will still be made in moving SoCs from one node to... » read more

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