tag: IBM

Why PCs And Servers Aren’t Going Away
By Ed Sperling - 22 Mar, 2012 - Comments: 0

By Pallab Chatterjee With the rise of mobile appliances, smart phones and tablets, there has been a lot of discussion about the place for PCs, servers, embedded processors and networks. A number of companies have claimed they will rule the world of computing and there will no room for others. Reality seems to be somewhat different, however. The mobile end point devices—smart phones, table... » read more

FD-SOI – Consortium Results (Part 2 of 3): Power and Performance
By Various Writers - 21 Mar, 2012 - Comments: 0

The results of the most recent SOI Consortium benchmarking study detail the interest of planar FD-SOI as early as the 28nm and 20nm technology nodes, in terms of performance, power and manufacturability. This 3-part blog series looks further at some of the implications. ~~ Fully depleted transistor architectures such as Planar FD-SOI, FinFETs (which is also a fully-depleted technolog... » read more

FD-SOI Workshop ppts – STM’s 1st 28nm FD-SOI product line
By Various Writers - 12 Mar, 2012 - Comments: 0

The SOI Consortium’s 6th FD-SOI workshop, held just after ISSCC, yielded some exciting news. Most of the presentations are freely available for downloading from the SOI Consortium website. Here are the highlights. STMicroelectronics In a terrific presentation by Giorgio Cesana, Marketing Director at STMicroelectronics, he revealed that the company would be releasing a major product line b... » read more

FD-SOI – Recent Consortium Results (Part 1 of 3): Manufacturing
By Various Writers - 05 Mar, 2012 - Comments: 0

The most recent SOI Consortium benchmarking study regarding 28nm and 20nm FD-SOI results (silicon-calibrated simulations at the 28nm node of complex circuits including ARM cores and DDR3 memory controllers) covered a lot of ground. This post is part 1 of a 3-part blog series that will be highlighting key points with respect to: 1. manufacturing; 2. power & performance; 3. 20nm benchmarking ... » read more

Different Tradeoffs
By Ed Sperling - 23 Feb, 2012 - Comments: 0

By Ed Sperling The push to “smaller, faster and cheaper” hasn’t changed since ICs were first introduced, but the context for those requirements is beginning to shift—with enormous consequences. What was once done on multiple chips continue to migrate to a single chip or package because of cost, but in some cases the decisions about goes where go well beyond an individual device to i... » read more

Different Tradeoffs
By Ed Sperling - 23 Feb, 2012 - Comments: 0

By Ed Sperling The push to “smaller, faster and cheaper” hasn’t changed since ICs were first introduced, but the context for those requirements is beginning to shift—with enormous consequences. What was once done on multiple chips continue to migrate to a single chip or package because of cost, but in some cases the decisions about goes where go well beyond an individual device to i... » read more

Reverse Engineering
By Ed Sperling - 26 Jan, 2012 - Comments: 0

By Ed Sperling Fabs and foundries frequently have been the savior of flawed designs, fixing problems such as power and performance, identifying design issues and often developing solutions to those problems. Over the next couple of process nodes, and in stacked die that will span multiple processes, there will be far fewer saves coming from the back end. Double and triple patterning, stress... » read more

Ambient Computing: Interdependencies Rule
By Ed Sperling - 26 Jan, 2012 - Comments: 0

By Ann Steffora Mutschler Ambient computing: Just the concept conjures up images of a Star Trek-like ‘Computer’ that is ever at the ready, awaiting a query at any moment, and which can discern as well as perform significant tasks. While Apple’s Siri gets there partway, it is significant because the concepts that make the technology possible behind the scenes draw upon a multidisciplinary... » read more

3D DRAM Makers Inch Closer To Production
By Ed Sperling - 01 Dec, 2011 - Comments: 0

By Mark LaPedus For some time, DRAM makers have been developing 3D memory chips, but commercial products still are not due out for some time because of technical and cost issues. But the advent of the 3D DRAM era could be near the turning point, as two memory rivals have separately moved to bring their respective technologies closer to production. In one move, Micron Technology Inc. has di... » read more

SOI Conference Shows SOI Driving Key Roadmaps
By Various Writers - 21 Oct, 2011 - Comments: 0

By Adele Hars The 2011 IEEE SOI Conference, held in Tempe, AZ last week was not one to miss…but I did. Happily, I got the papers right away, along with observations shared by some of the folks who did get there. Highlights include excellent and insightful papers from ST, ARM, IBM, Intel, Leti, Peregrine and GlobalFoundries, plus many more that indicate SOI-based technologies are at th... » read more

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