tag: Intel

Week In Review: Manufacturing, Test
By Mark LaPedus - 27 Aug, 2021 - Comments: 0

Chipmakers, OEMs Reports have surfaced that TSMC has delayed its 3nm process. But TSMC says the technology remains on track. Volume production for TSMC’s 3nm is still scheduled for the second half of 2022. On the flip side, there is speculation that TSMC may increase its wafer prices by up to 20%, according to a report from the Taipei Times. Here's another report. This is due to chip shortag... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 27 Aug, 2021 - Comments: 0

Automotive The chip shortage continues to affect automotive OEMs around the world. Ford is cutting production of its F-150 pickup truck. It is not just passenger car production that is affected. The transportation industry will see chip shortages with 5+ month lead times through the end of 2021, according to ABI Research. Some of the shortages will be in telematics chips, due to high demand wh... » read more

New Approaches For Processor Architectures
By Ed Sperling - 26 Aug, 2021 - Comments: 0

Processor vendors are starting to emphasize microarchitectural improvements and data movement over process node scaling, setting the stage for much bigger performance gains in devices that narrowly target what end users are trying to accomplish. The changes are a recognition that domain specificity, and the ability to adjust or adapt designs to unique workloads, are now the best way to impro... » read more

Blog Review: Aug. 25
By Jesse Allen - 25 Aug, 2021 - Comments: 0

Arm's Fernando Garcia Redondo, Pranay Prabhat, and Mudit Bhargava introduce an open source framework and compact model for the simulation, characterization, and analysis of MRAM magnetic tunnel junctions. Siemens EDA's Chris Spear continues the tutorial on SystemVerilog class variables with a look at how to use the $cast() system task to copy between base and derived class variables. Syno... » read more

Manufacturing Bits: Aug. 24
By Mark LaPedus - 24 Aug, 2021 - Comments: 0

Panel packaging consortium Fraunhofer Institute for Reliability and Microintegration IZM has provided an update on a consortium that is developing panel-level IC packaging technologies. Fraunhofer IZM is leading the consortium. The R&D organization and its partners, including Intel and others, have made progress in terms of equipment, processes and other technologies in the so-called Pa... » read more

Inside Intel’s Ambitious Roadmap
By Mark LaPedus and Ed Sperling - 23 Aug, 2021 - Comments: 2

Ann Kelleher, senior vice president and general manager of Technology Development at Intel, sat down with Semiconductor Engineering to talk about the company’s new logic roadmap, as well as lithography, packaging, and process technology. What follows are excerpts of that discussion. SE: Intel recently disclosed its new logic roadmap. Beyond Intel 3, the company is working on Intel 20A. Wit... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 20 Aug, 2021 - Comments: 0

Chipmakers, OEMs At Intel’s Architecture Day this week, the company revealed several new chip architectures. Some were already announced, while others are new. These include Intel’s first performance hybrid architecture, a data center architecture, a discrete gaming graphics processing unit (GPU) architecture, infrastructure processing units (IPUs), and a data center GPU architecture. Here... » read more

Manufacturing Bits: Aug. 17
By Mark LaPedus - 17 Aug, 2021 - Comments: 0

Scaling qubits Australia is a hotbed of R&D activity, especially in the field of quantum computing. For example, the University of New South Wales (UNSW) in Australia has demonstrated a possible way to control millions of qubits in a silicon quantum chip. Researchers from UNSW Sydney have devised a new three-dimensional dielectric resonator, a technology that could deliver controlled... » read more

IChannels: Exploiting Current Management Mechanisms to Create Covert Channels in Modern Processors
By Technical Paper Link - 11 Aug, 2021 - Comments: 0

Find technical paper link here. Abstract: "To operate efficiently across a wide range of workloads with varying power requirements, a modern processor applies different current management mechanisms, which briefly throttle instruction execution while they adjust voltage and frequency to accommodate for power-hungry instructions (PHIs) in the instruction stream. Doing so 1) reduces the pow... » read more

Has Computational Storage Finally Arrived?
By Andy Patrizio - 11 Aug, 2021 - Comments: 2

The idea behind computational storage is not new. It’s just that like so many concepts, the idea has been well ahead of the technology. In a nutshell, computational storage brings processing power to the storage level. It eliminates the need to load data from the storage system into memory for processing. Moving data between storage and compute resources is inefficient and computational sy... » read more

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