tag: MIT

MIT & UC Berkeley: “Exo” Programming Language Writes High Performance Code For HW Accelerators
By Technical Paper Link - 11 Jul, 2022 - Comments: 0

New research paper titled "Exocompilation for productive programming of hardware accelerators," from researchers at MIT and UC Berkeley. From their abstract: "To better support development of high-performance libraries for specialized hardware, we propose a new programming language, Exo, based on the principle of exocompilation: externalizing target-specific code generation support and op... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 24 Jun, 2022 - Comments: 0

Automotive, mobility The U.S. Department of Transportation’s National Highway Traffic Safety Administration (NHTSA) published a notice of proposed rulemaking (NPRM) to change the regulations on event data recorders (EDRs) to extend the EDR recording period for “timed data metrics from 5 seconds of pre-crash data at a frequency of 2 Hz to 20 seconds of pre-crash data at a frequency of 10 Hz... » read more

Technical Paper Round-up: June 14
By Linda Christensen - 14 Jun, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=33 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit f... » read more

MIT: Stackable AI Chip With Lego-style Design
By Technical Paper Link - 13 Jun, 2022 - Comments: 0

New technical paper titled "Reconfigurable heterogeneous integration using stackable chips with embedded artificial intelligence" from researchers at MIT, along with Harvard University, Tsinghua University, Zhejiang University, and others. Partial Abstract: "Here we report stackable hetero-integrated chips that use optoelectronic device arrays for chip-to-chip communication and neuromorphic... » read more

Technical Paper Round-up: May 17
By Linda Christensen - 17 May, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=27 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a go... » read more

MIT Researchers Create Thin-Film Speakers
By Technical Paper Link - 09 May, 2022 - Comments: 0

New academic paper from MIT, "An Ultra-Thin Flexible Loudspeaker Based on a Piezoelectric Micro-Dome Array." Abstract: "Ultra-thin, lightweight, high-performance, low-cost and energy-efficient loudspeakers that can be deployed over a wide area have become increasingly attractive to both traditional audio systems and emerging applications such as active noise control and immersive entertainm... » read more

Technical Paper Round-up: April 26
By Linda Christensen - 26 Apr, 2022 - Comments: 0

Find all technical papers in Semiconductor Engineering’s library. [table id=23 /]   Semiconductor Engineering is in the process of building this library of research papers.  Please send suggestions for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a ... » read more

Stress tensor mesostructures for deterministic figuring of thin substrates
By Technical Paper Link - 21 Apr, 2022 - Comments: 0

New research paper from MIT and University of Arizona, funded by NASA. Abstract "Accessing the immense value of freeform surfaces for mass-sensitive applications such as space optics or metaform optical components requires fabrication processes that are suited to figuring thin substrates. We present stress tensor mesostructures for precisely correcting figure errors, even after microstruc... » read more

Technical Paper Round-Up: April 19
By Linda Christensen - 19 Apr, 2022 - Comments: 0

New technical papers include selective etching, ISO 26262 test bench, hardware accelerators, RISC-V, lidar, EUV mask inspection, fault attacks, edge computing, gallium oxide, and machine learning for VLSI CAD-on-chip power grid design. Cutting-edge research is now a global effort. It extends from the U.S. Air Force, to schools such as MIT, and universities in Italy, Spain, Portugal, India, K... » read more

Selective etching of silicon nitride over silicon oxide using ClF3 /H2 remote plasma
By Technical Paper Link - 18 Apr, 2022 - Comments: 0

Researchers from Sungkyunkwan University, MIT and others present an option for selective etching. Abstract "Precise and selective removal of silicon nitride (SiNx) over silicon oxide (SiOy) in a oxide/nitride stack is crucial for a current three dimensional NOT-AND type flash memory fabrication process. In this study, fast and selective isotropic etching of SiNx over SiOy has been investiga... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy