tag: Mentor Graphics

EDA Tools, IP Sales Up
By Ed Sperling - 15 Jul, 2014 - Comments: 0

EDA sales grew 4.6% in the first quarter, down slightly year-over-year as sales in Japan dragged down the rest of the market. Sales in Japan dropped 19% year over year as the country’s electronics industry struggles for footing against rivals in China and South Korea. North America and Europe grew 7% and 7.5% respectively, according to statistics provided by the EDA Consortium. Within thos... » read more

DAC’s Front Line…Soha, Chuck And Me
By Anne Cirkel - 14 Jul, 2014 - Comments: 1

In Brazil the drama continues, though that may be understating what happened yesterday. I’m still rendered nearly speechless by the result from Belo Horizonte, where all sorts of history was made. Of course I’m thrilled that Germany has a chance to win its first World Cup since 1990, though like much of Fussball-fandom I’m stunned and even a bit unnerved at how easy they made it look in t... » read more

The Week In Review: Design
By Ed Sperling - 11 Jul, 2014 - Comments: 0

M&A CEVA bought RivieraWaves, which makes IP for WiFi and Bluetooth connectivity. CEVA said the deal will boost its market to 35 billion connected devices within six years. The two companies have been collaborating in the WiFi market for the past couple of years. Total cost of the deal is $19 million. Mentor Graphics acquired XS Embedded GmbH, a German-based developer of automotive-read... » read more

Supporting LP In New Process Nodes
By Ann Mutschler - 10 Jul, 2014 - Comments: 0

Manufacturing process nodes and EDA tools are advancing all the time, but not always utilized at the same pace. And from a tools perspective, there are challenges to supporting low power in new process nodes while maintaining and improving the existing process nodes. One way design teams address this is by leveraging the most advanced software on the less-than-bleeding edge designs. To th... » read more

Stacked Die Are Coming Soon. Really
By Ed Sperling - 10 Jul, 2014 - Comments: 3

Since the beginning of the decade there have been many predictions that stacked die were just over the hill, but the time it has taken to climb that hill has been longer than most people would have anticipated. In fact, TSMC has been fully capable of building stacked die since last year, with risk production expected to be completed by year, according to Gartner. But something very fundament... » read more

28nm FinFETs?
By Brian Bailey - 10 Jul, 2014 - Comments: 5

One star of the upcoming 14/16nm process node is the introduction of the finFET, a fundamentally new transistor that overcomes many of the limitations associated with planar transistors. While these devices are more complex to construct—and the physical extraction processes associated with them is more complex due to an increased number of resistances and capacitances—they are seen as a tra... » read more

How Effective Power Management Increases The Lifetime Operation Of Portable Medical Devices
By Mentor, a Siemens Business - 09 Jul, 2014 - Comments: 0

To enable remote patient care and provide increased mobility in hospital settings portable medical devices, Personal Area Networks (PANs), and home health systems are seeing a significant increase in investment spending. When designing a portable medical device, decisions on processor and component selection are dependent on a range of variables which include performance, price, quality, and re... » read more

Blog Review: July 9
By Ed Sperling - 09 Jul, 2014 - Comments: 0

Cadence’s Richard Goering walks through a keynote speech from DAC, which was delivered by Imagination Technologies’ Peter McGuinness, about the evolving role of image processing and what it can do. There are lots of changes ahead in this space. Who’s financing the Internet of Things and what are they funding? ARM’s Brad Nemire takes a look at oort, a Bluetooth hub that looks like a ... » read more

DFM And Multipatterning
By Ed Sperling - 03 Jul, 2014 - Comments: 0

Semiconductor Engineering sat down to discuss DFM at advanced nodes with Kuang-Kuo Lin, director of foundry design enablement at Samsung Electronics; Jongwook Kye, lithography modeling and architecture fellow at GlobalFoundries; David Abercrombie, advanced physical verification methodology program manager at Mentor Graphics; Ya-Chieh Lai, engineering director for DFM/CLS silicon signoff and ver... » read more

The Week In Review: Design
By Ed Sperling - 03 Jul, 2014 - Comments: 0

Tools The Android Open Source Project for ARM’s v8-A architecture is now available as part of the Linaro 14.06 release. The release has been tested on 64-bit multicore processors. Research NXP conducted a secure credit card survey that showed Americans are more likely to pay cash following security breaches at large retail chains, with 69% in favor of secure credit cards to guard against... » read more

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