tag: NAND

What Is Spin Torque MRAM?
By Mark LaPedus - 17 Aug, 2017 - Comments: 0

The memory market is going in several different directions at once. On one front, the traditional memory types, such as DRAM and flash, remain the workhorse technologies. Then, several vendors are readying the next-generation memory types. As part of an ongoing series, Semiconductor Engineering will explore where the new and traditional memory technologies are heading. For this segment, P... » read more

Enabling Higher System Performance With NVDIMM-N
By Sarvagya Kochak - 10 Aug, 2017 - Comments: 0

The shift from the traditional enterprise data center to the cloud is driving an insatiable demand for increased bandwidth and lower latencies. This is fundamentally reshaping traditional memory, storage, network and computing architectures. Although the semiconductor industry has been innovating to meet the needs of these new architectures, it continues to grapple with a waning Moore’s Law t... » read more

NAND Market Hits Speed Bump
By Mark LaPedus - 21 Jun, 2017 - Comments: 5

Demand for NAND flash memory remains robust due to the onslaught of data in systems, but the overall NAND flash market is stuck in the middle of a challenging period beset by product shortages, supply chain issues and a difficult technology transition. Intel, Micron, Samsung, SK Hynix and the Toshiba/Western Digital duo continue to ship traditional planar NAND in the market, but this technol... » read more

Materials For Future Electronics
By Katherine Derbyshire - 18 May, 2017 - Comments: 0

Examining the research underway in electronics materials provides a keyhole view into what may be possible in future electronics design. Although some of this research will not end up in commercial products, it does provide an indication of the kinds of problems that are being addressed, how they are being approached, and where the research dollars are being spent. Flexible electronics are a... » read more

Wirebond Technology Rolls On
By Mark LaPedus - 08 May, 2017 - Comments: 2

Several years ago, many predicted the demise of an older interconnect packaging technology called wire bonding, prompting the need for more advanced packaging types. Those predictions were wrong. The semiconductor industry today uses several advanced packaging types, but wire bonding has been reinvented over the years and remains the workhorse in packaging. For example, Advanced Semiconducto... » read more

Inside Lithography And Masks
By Mark LaPedus - 01 May, 2017 - Comments: 1

Semiconductor Engineering sat down to discuss lithography and photomask technologies with Gregory McIntyre, director of the Advanced Patterning Department at [getentity id="22217" comment="IMEC"]; Harry Levinson, senior fellow and senior director of technology research at [getentity id="22819" comment="GlobalFoundries"]; David Fried, chief technology officer at [getentity id="22210" e_name="Cov... » read more

Wear Down Your Virtual Prototype
By Malte Doerper - 27 Apr, 2017 - Comments: 0

Just when you think you know all variations of embedded software development you are exposed to another domain of unique and interesting challenges. This happened to me awhile back when I started to learn about the software for Flash Memory controllers. You can read a lot about Flash market growth predictions or about the physical challenges of the next generation storage technologies he... » read more

Semiconductor CapEx To Increase 4.3% In 2017
By Adrienne Downey - 20 Feb, 2017 - Comments: 0

Semiconductor capital expenditures are an important bellwether for the industry. Based on preliminary findings, Semico Research predicts 2017’s total will increase 4.3% to $69.7 billion, a record high, and a slightly larger increase than in 2016. Semico tracks more than 80 companies for CapEx and R&D spending, although many of those companies have merged, have been acquired, or gone ba... » read more

Get Ready For Nanotube RAM
By Mark LaPedus - 20 Feb, 2017 - Comments: 6

The memory market is going in several different directions at once. On one front, the traditional memory types, such DRAM and flash, remain the workhorse technologies in systems despite undergoing some changes in the business. Then, several vendors are readying the next-generation memory types in the market. As part of an ongoing series, Semiconductor Engineering will explore where the new a... » read more

What’s Next For NOR Flash?
By Mark LaPedus - 16 Feb, 2017 - Comments: 0

The flash memory market is the tale two of cities. Today, NAND and NOR are the two main flash memory types. Over the years, the NAND flash market has exploded. Targeted for data storage, NAND flash has moved into flash cards, solid-state storage drives (SSDs) and other products. The excitement for NAND continues to mount, as the technology is moving from planar to a 3D structure. In fact, 3D... » read more

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