The Week In Review: Aug. 16


By Ed Sperling Manufacturing Equipment giant Applied Materials added three extra letters company president Gary Dickerson’s title—CEO. Mike Splinter, who has served as the company’s CEO since 2003, will become executive chairman of the board of directors. Dickerson was the CEO of Varian, which Applied Materials acquired in 2011. Synopsys introduced a Dolby decoder for its ARC process... » read more

A Brief History Of The Interconnect


By Kurt Shuler The high functional integration of system-on-chip designs today is driving the need for new technological approaches in semiconductor design. Anyone who owns a Samsung Galaxy S4, HTC One or comparable smartphone can see the benefits of integrating onto one chip all the computing functions that were traditionally separate, discrete chips on a PC computer motherboard. For next-gen... » read more

Faster IP Integration


By Ed Sperling System-Level Design sat down with Laurent Moll, chief technology officer at Arteris, to talk about interoperability, complexity and integration issues. What follows are excerpts of that conversation. SLD: What’s the big challenge with IP? Moll: Interoperability is always a concern. Because of ARM’s dominance, a lot of people are moving to AMBA protocols, whether that’... » read more

Life After Smartphones


By Frank Ferro Don’t let the title confuse you. Smartphones are not going away anytime soon. In fact this year’s smartphone shipments have exceeded feature phones for the first time, with a total of 216 million units in Q1, according to IDC, and the overall mobile phone market is expected to grow 4.3% in 2013. This volume represents an increase in smartphone sales of 42% from Q1 2012. ... » read more

The Week In Review: June 7


By Ed Sperling For all the hesitation about moving the Design Automation Conference to Austin, it turns out that Austin has a lot of hardware engineers. In fact they flooded into the conference, turning it into one of the most successful in recent years and setting new records in multiple areas. Even Texas Gov. Rick Perry showed up to see what all the fuss was about. Mentor Graphics added c... » read more

The X Factor


By Ed Sperling The number of unknowns is growing in every segment of SoC design all the way through manufacturing, raising the stakes between reliability and the tradeoffs necessary to meet market windows. Tools are available to deal with some of these unknowns, or X’s, but certainly not all of them. Moreover, no single tool can handle all unknowns, some of which can build upon other unkn... » read more

The Analyst View


By Kurt Shuler I was fortunate to be able to meet with 13 different semiconductor industry analysts from eight different companies over the last two weeks. Our conversations ranged from the current state of the semiconductor industry to future software architecture trends. I want to take this opportunity to thank them once again for the exchange of ideas and the opportunity to learn from them.... » read more

The Rise Of Layout-Dependent Effects


By Ann Steffora Mutschler Designing for today’s advanced semiconductor manufacturing process nodes brings area, speed, power and other benefits but also new performance challenges as a result of the pure physics of running current through tiny wires. Layout-dependent effects (LDE), which emerged at 40nm and are having a larger impact at 28 and 20nm, introduce variability to circuit ... » read more

Advanced SoC Interconnect IP


By Kurt Shuler I am thoroughly enjoying 2013. That’s because there seems to be a lot more reason for optimism this year than last year. But before we let go of 2012, it’s important to reflect on the past year and see what it can teach us so we can make better business decisions moving forward. The one lesson learned is that flexibility for SoC designs is increasingly more important. In ... » read more

Chip Economics


The concise research paper, "NoC Interconnect Improves SoC Economics: Initial Investment is Low Compared to SoC Performance and Cost Benefits," by Objective Analysis Semiconductor Market Research, provides quantitative data from user experiences comparing the costs and benefits of implementing network on chip SoC interconnects versus traditional bus and crossbar interconnects. You will learn... » read more

← Older posts Newer posts →