tag: packaging

Shifting Left: Early Multi Physics Analysis For STCO
By Per Viklund - 24 Jun, 2021 - Comments: 0

With the economics of transistor scaling no longer universally applicable, the industry is turning to innovative packaging technologies to support system scaling demands and achieve lower system cost. This has led to the emergence of a system technology co-optimization (STCO) approach, in which an SoC is disaggregated into smaller modules (also known as chiplets) that can be asynchronously desi... » read more

Qualifying Exposed Pad TQFP For AEC-Q006 Grade 0
By Yoshio Matsuda - 17 Jun, 2021 - Comments: 0

Semiconductor packages used in various vehicle applications require high reliability. As technological innovations in the automotive market increase, the demand for highly reliable packaging is increasing for applications in autonomous driving, human interfaces, electric vehicles (EVs), hybrid electric vehicles (HEVs) and more. Package reliability is essential because automotive packages must p... » read more

Automotive Chip Shortages: An Assembly Perspective
By Prasad Dhond - 20 May, 2021 - Comments: 0

Since March 2020, the pandemic has brought on scarcity in odd goods like toilet paper, baking flour and exercise equipment. The latest casualty is the auto industry as car production across the world has been hobbled by chip shortages. While much has been written about the role of semiconductor suppliers, foundries, wafer fab equipment, fires, and snowstorms in the chip shortages, we should als... » read more

Adding Value With Unit Level Traceability (ULT) In Automotive Packaging
By Amkor - 20 May, 2021 - Comments: 0

Automotive product traceability has existed in one form or another for several decades. Traceability generally refers to tracking and tracing each component that comprises every subsystem in a car. Traditionally, this has been achieved with direct part marking on mechanical or electronic components, using 1D or 2D barcodes or radio-frequency identification (RFID). Since vehicle recalls are cost... » read more

Debug And Traceability Of MCMs And Chiplets In The Manufacturing Test Process
By Guy Cortez - 16 Apr, 2021 - Comments: 0

Single die packages and products have been the norm for decades. Moreover, so has multi-chip modules (MCMs) or system in package (SiP) for quite some time. Understandably, with ASICs and SoCs becoming larger while silicon geometries continue to get smaller, there is an opportunity to combine even more functionality into a smaller form factor for the end product. Hence, new advancements in desig... » read more

Making Chip Packaging More Reliable
By Mark LaPedus - 15 Apr, 2021 - Comments: 0

Packaging houses are readying the next wave of IC packages, but these products must prove to be reliable before they are incorporated into systems. These packages involve several advanced technologies, such as 2.5D/3D, chiplets and fan-out, but vendors also are working on new versions of more mature package types, like wirebond and leadframe technologies. As with previous products, packaging... » read more

Shortages, Challenges Engulf Packaging Supply Chain
By Mark LaPedus - 18 Feb, 2021 - Comments: 0

A surge in demand for chips is impacting the IC packaging supply chain, causing shortages of select manufacturing capacity, various package types, key components, and equipment. Spot shortages in packaging surfaced in late 2020 and have since spread to other sectors. There are now a variety of choke points in the supply chain. Wirebond and flip-chip capacity will remain tight throughout 2021... » read more

Increasing The Conductive Density Of Packaging
By Shaun Bowers - 18 Feb, 2021 - Comments: 0

Wide bandgap (WBG) semiconductor technologies have created new challenges and opportunities for power packages. Developments such as silicon carbide (SiC) and gallium nitride (GaN), have a higher figure of merit (FOM) compared to silicon MOSFETs and have extended the efficiency, output power and/or switching frequency range and operating temperature range for power electronics. With lower lo... » read more

Packaging Demands For RF And Microwave Devices
By Ken Molitor - 18 Feb, 2021 - Comments: 1

RF and microwave integrated circuits (ICs), monolithic microwave ICs (MMICs) and systems in package (SiPs) are vital for a wide range of applications. These include mobile phones, wireless local-area networks (WLANs), ultra-wideband (UWB), internet-of-things (IoT), GPS and Bluetooth devices. Moreover, RF-optimized packaging products and processes are essential to enabling the 5G ramp-up. RFI... » read more

WLFO For High-Performance Low-Cost Packaging Of RFMEMS-CMOS
By Amkor - 17 Feb, 2021 - Comments: 0

Navigating the trade-offs between performance, size, cost and reliability can be a challenge when considering integrated circuit (IC) packaging and the end-application. The integration of micro-electromechanical systems (MEMS), either monolithic or heterogeneous, introduces yet another level of complexity that has only recently been a major focus of multi-device packaging. Wafer-level fanout (W... » read more

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