tag: Synopsys

Electromigration Concerns Grow In Advanced Packages
By Laura Peters - 18 Apr, 2024 - Comments: 0

The incessant demand for more speed in chips requires forcing more energy through ever-smaller devices, increasing current density and threatening long-term chip reliability. While this problem is well understood, it's becoming more difficult to contain in leading-edge designs. Of particular concern is electromigration, which is becoming more troublesome in advanced packages with multiple ch... » read more

What Works Best For Chiplets
By Anne Meixner - 18 Apr, 2024 - Comments: 0

The semiconductor industry is preparing for the migration from proprietary chiplet-based systems to a more open chiplet ecosystem, in which chiplets fabricated by different companies of various technologies and device nodes can be integrated in a single package with acceptable yield. To make this work as expected, the chip industry will have to solve a variety of well-documented technical an... » read more

Enabling New Applications With SiC IGBT And GaN HEMT For Power Module Design
By Shela Aboud - 18 Apr, 2024 - Comments: 0

The need to mitigate climate change is driving a need to electrify our infrastructure, vehicles, and appliances, which can then be charged and powered by renewable energy sources. The most visible and impactful electrification is now under way for electric vehicles (EVs). Beyond the transition to electric engines, several new features and technologies are driving the electrification of vehicles... » read more

IC Compiler II: Finding The Best Floorplan, Fast
By Synopsys - 17 Apr, 2024 - Comments: 0

As designers strive to pack more and more functionality into todays’ SoC’s, design size (in terms of the number of transistors packed into a chip) is growing almost exponentially. This growth brings with it an unbounded increase in not just the technical complexity of performing the physical layout of the design due to capacity challenges, but also requires designers to make choices that ca... » read more

Blog Review: April 17
By Jesse Allen - 17 Apr, 2024 - Comments: 0

Siemens' Sumit Vishwakarma highlights the importance of crystal oscillators to the proper functioning of many semiconductor devices and applications, from clock signals to transmission and reception of radio waves. Cadence's Jay Domadia introduces some of the new features in GDDR7, such as a semi-independent row and column command address bus and two modes of data signaling, enabling PAM3 fo... » read more

Future-Proofing Automotive V2X
By Ann Mutschler - 17 Apr, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss Vehicle-To-Everything (V2X) technology and the path to deployment with Shawn Carpenter, program director, 5G and space at Ansys; Lang Lin, principal product manager at Ansys; Daniel Dalpiaz, senior manager product marketing, Americas, green industrial power division at Infineon; David Fritz, vice president of virtual and hybrid... » read more

Architecting Chips For High-Performance Computing
By Ann Mutschler - 15 Apr, 2024 - Comments: 0

The world’s leading hyperscaler cloud data center companies — Amazon, Google, Meta, Microsoft, Oracle, and Akamai — are launching heterogeneous, multi-core architectures specifically for the cloud, and the impact is being felt in high-performance CPU development across the chip industry. It's unlikely that any these chips will ever be sold commercially. They are optimized for specific ... » read more

Chip Industry Week In Review
By The SE Staff - 12 Apr, 2024 - Comments: 0

Applied Materials may scale back or cancel its $4 billion new Silicon Valley R&D facility in light of the U.S. government's recent announcement to reduce funding for construction, modernization, or expansion of semiconductor research and development (R&D) facilities in the United States, according to the San Francisco Chronicle. TSMC could receive up to $6.6 billion in direct funding... » read more

Memory On Logic: The Good And Bad
By Brian Bailey - 11 Apr, 2024 - Comments: 0

The chip industry is progressing rapidly toward 3D-ICs, but a simpler step has been shown to provide gains equivalent to a whole node advancement — extracting distributed memories and placing them on top of logic. Memory on logic significantly reduces the distance between logic and directly associated memory. This can increase performance by 22% and reduce power by 36%, according to one re... » read more

Using AI/ML To Minimize IR Drop
By Ann Mutschler - 11 Apr, 2024 - Comments: 1

IR drop is becoming a much bigger problem as technology nodes scale and more components are packed into advanced packages. This is partly a result of physics, but it's also the result of how the design flow is structured. In most cases, AI/ML can help. The underlying problem is that moving to advanced process nodes, and now 3D-ICs, is driving current densities higher, while the power envelop... » read more

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