A Novel Memory Test System With An Electromagnet For STT-MRAM Testing


We have successfully developed, for the first time, a new memory test system for STT-MRAM at wafer-level where an electromagnet is combined with a memory test system and a 300 mm wafer prober. In the developed memory test system, an out-of-plane magnetic field up to ±800 mT can be applied on 10 x 10 mm2 in the 300 mm wafer with distribution of less than 2.5%. We demonstrated that the electroma... » read more

Merging Verification And Test


While the disciplines of functional verification and test serve different purposes, their histories were once closely intertwined. Recent safety and security monitoring requirements coupled with capabilities being embedded into devices is bringing them closer together again, but can they successfully cooperate to bring about improvements in both? Getting there may be difficult. Three phases ... » read more

Enabling The Next Step In IC Test And Monitoring


Product lifecycle management (PLM) is a well-established concept across many industries that aims to manage the entire lifecycle of a product from inception through design, realization, deployment, and field service, right through to end-of-life activities such as final disposal. More recently, these principles are being applied by the semiconductor industry because electronics continue to p... » read more

Debug And Traceability Of MCMs And Chiplets In The Manufacturing Test Process


Single die packages and products have been the norm for decades. Moreover, so has multi-chip modules (MCMs) or system in package (SiP) for quite some time. Understandably, with ASICs and SoCs becoming larger while silicon geometries continue to get smaller, there is an opportunity to combine even more functionality into a smaller form factor for the end product. Hence, new advancements in desig... » read more

MIPI D-PHY RX⁺: An Optimized Test Configuration


With the proliferation of the mobile platform, the accelerating adoption of MIPI beyond the traditional mobile platform and into safety related applications, testability of MIPI® PHY is becoming a key requirement. While the D-PHY is the MIPI PHY with the widest adoption in the industry today, the RX+ is a D-PHY receiver configuration optimized for full-speed production testing. The presentatio... » read more

AI In Inspection, Metrology, And Test


AI/ML is creeping into multiple processes within the fab and packaging houses, although not necessarily for the purpose it was originally intended. The chip industry is just beginning to learn where AI makes sense and where it doesn't. In general, AI works best as a tool in the hands of someone with deep domain expertise. AI can do certain things well, particularly when it comes to pattern m... » read more

How Heterogeneous ICs Are Reshaping Design Teams


Experts at the Table: Semiconductor Engineering sat down to discuss the complex interactions developing between different engineering groups as designs become more heterogeneous, with Jean-Marie Brunet, senior director for the Emulation Division at Siemens EDA; Frank Schirrmeister, senior group director for solution marketing at Cadence; Maurizio Griva, R&D Manager at Reply; and Laurent Mai... » read more

Meeting The Challenges Of 5G RF Production Test Services


Implementation of the 5G radio frequency (RF) standard is increasing rapidly [1]. Over the past four to six quarters, there has been an increased focus on publications and products that have been introduced to the marketplace. Some of the more popular RF eco-system applications include cellphone, Wi-Fi, automotive, Internet of Things (IoT), location services, and more. Wi-Fi and cellphone servi... » read more

Development Of Digital Controlled Technology For High Voltage DC Testing


In recent years, the demand for low power devices has increased due to issues related to global environmental protection. As a result, the demand for high-voltage power devices has also increased. To test such devices, test equipment that can handle high-voltage devices (hereinafter referred to as “test equipment”) is required. In addition, test time must be shortened to reduce manufacturin... » read more

When Is Verification Done?


Even with the billions of dollars spent on R&D for EDA tools, and tens of billions more on verification labor, only 30% to 50% of ASIC designs are first time right, according to Wilson Research Group and Siemens EDA. Even then, these designs still have bugs. They’re just not catastrophic enough to cause a re-spin. This means more efficient verification is needed. Until then, verificati... » read more

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