Accellera Updates UVM Standard


Accellera uncorked its backward-compatible UVM 1.2 standard, which fixes dozens of bugs, including sequences for run-time phasing and support for multithreading. “We’ve solved more than a dozen incompatibilities and improved overall productivity,” said Intel’s Thomas Alsop, who serves as co-chair of the UVM (Universal Verification Methodology) working group. “This is a major releas... » read more

The Week In Review: Design


Tools Mentor Graphics rolled out embedded Linux software for AMD’s x86 G-series SoCs, code-named Steppe Eagle and its Crowned Eagle CPUs. Ansys-Apache and TowerJazz have created a power noise and reliability signoff design kit, including reference flow guidelines, test case examples and flow setup guidance. Synopsys updated its verification portfolio with static and formal tools for CD... » read more

Executive Insight: Adnan Hamid


Semiconductor Engineering sat down with Adnan Hamid, founder and CEO of Breker Verification Systems. Breker was founded in 2003 and has been concentrating on the creation of verification methodologies for multiprocessor SoCs using graph-based entry methods – something that became a hot topic at DVCon 2014 after Mentor Graphics decided to donate its format to Accellera for standardization. ... » read more

The Week In Review: Design


Tools Ansys-Apache rolled out a new version of its power noise and reliability tool for finFET-based designs. Given the fact that dynamic power is going to be a massive headache at 14/16nm and beyond due to much greater density, this is a first step in dealing with it. This is just the beginning of a massive effort by EDA to retool for finFETs and the 2.5D/3D architectures. Synopsys rolled... » read more

Blog Review: April 2


Mentor’s Nazita Saye compares roadway roundabouts to networked systems. One roundabout works fine, but add in a bunch of them and you have a massive traffic jam. How many roundabouts are in your design? Cadence’s Richard Goering interviews Stan Kroliskoski, chair of the IEEE Design Automation Standards Committee, about four working groups on EDA standards and what’s ahead. Speaking ... » read more

Get Ready For DVCon Europe


By Martin Barnasconi DVCon Europe, a new conference and exhibition around design and verification, will be held Oct. 14-15 in Munich, Germany. Call for abstracts for DVCon Europe is open through April 8. The obvious question is why DVCon Europe. DVCon and its predecessor conferences have been held successfully in the Silicon Valley for more than 20 years. The conference is extremely success... » read more

The Week In Review: Design


Tools Synopsys rolled out a new version of its software technologies for static and formal verification, which it says increases performance by up to five times. Also new are improved debug and low-power verification with native power simulation, and an integrated IP portfolio. Cadence uncorked a new version of its PCB and packaging environment, which it says speeds up timing closure by as ... » read more

2014 Accellera Standards Are Built on Powerful Shoulders


By Adam Sherer Looking out at the fresh snow coating the landscape here in Buffalo, it’s tempting to look toward 2014 and focus only on the fresh and new. However, if I’ve learned anything about this city from the day I arrived here as a freshman EE in 1984, it’s that you don’t bury your foundation. Instead, you recognize it as your greatest strength, the powerful shoulders upon whic... » read more

Blog Review: Jan. 8


How do you choose an embedded operating system—and do you even need one? Mentor’s Colin Walls looks at the options, and the reason why there are no simple answers. Cadence’s Richard Goering has evidence that Facebook is gaining in popularity for engineer. He’s not the first person to recognize this shift, but the big unanswered questions are, ‘What’s the average age of those use... » read more

Where Is 2.5D?


After nearly five years of concentrated research, development, test chips and characterization, 2.5D remains a possibility for many companies but a reality for very few. So what’s taking so long and why hasn’t all of this hype turned into production runs instead of test chips? Semiconductor Engineering spent the past two months interviewing dozens of people on this subject, from chipmakers ... » read more

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