ResNet-50 Does Not Predict Inference Throughput For MegaPixel Neural Network Models


Customers are considering applications for AI inference and want to evaluate multiple inference accelerators. As we discussed last month, TOPS do NOT correlate with inference throughput and you should use real neural network models to benchmark accelerators. So is ResNet-50 a good benchmark for evaluating relative performance of inference accelerators? If your application is going to p... » read more

Blog Review: Nov. 4


Arm's Joshua Sowerby points to how to improve machine learning performance on mobile devices by using smart pruning to remove convolution filters from a network, reducing its size, complexity, and memory footprint. Mentor's Neil Johnson checks out how designers can write and verify RTL real-time using formal property checking in the style of test-driven development and why to give it a try. ... » read more

Speeding Up AI With Vector Instructions


A search is underway across the industry to find the best way to speed up machine learning applications, and optimizing hardware for vector instructions is gaining traction as a key element in that effort. Vector instructions are a class of instructions that enable parallel processing of data sets. An entire array of integers or floating point numbers is processed in a single operation, elim... » read more

Security Tradeoffs In Chips And AI Systems


Semiconductor Engineering sat down to discuss the cost and effectiveness of security in chip architectures and AI systems with with Vic Kulkarni, vice president and chief strategist at Ansys; Jason Oberg, CTO and co-founder of Tortuga Logic; Pamela Norton, CEO and founder of Borsetta; Ron Perez, fellow and technical lead for security architecture at Intel; and Tim Whitfield, vice president of s... » read more

Startup Funding: October 2020


October 2020 was a big month for startups across the automotive space, with sizeable funding all around. Three startups based out of China brought in over $100M apiece for ADAS and autonomous driving, and a fourth U.S.-based startup saw $125M investment for simulating and testing autonomous driving systems. Two electric vehicle manufacturers also received $100M+ rounds. Collectively, the auto c... » read more

Week In Review: Design, Low Power


M&A AMD will acquire Xilinx for $35 billion in an all-stock deal. "Joining together with AMD will help accelerate growth in our data center business and enable us to pursue a broader customer base across more markets,” said Victor Peng, Xilinx president and CEO. The deal is expected to close by the end of 2021. The acquisition of the programmable logic giant will leave only a few purepla... » read more

A Renaissance For Semiconductors


Major shifts in semiconductors and end markets are driving what some are calling a renaissance in technology, but navigating this new, multi-faceted set of requirements may cause some structural changes for the chip industry as it becomes more difficult for a single company to do everything. For the past decade, the mobile phone industry has been the dominant driver for the semiconductor eco... » read more

Regaining The Edge In U.S. Chip Manufacturing


The United States is developing new strategies to prevent it from falling further behind Korea, Taiwan, and perhaps even China in semiconductor manufacturing, as trade tensions and national security concerns continue to grow. For years, the U.S. has been a leader in the development of new chip products like GPUs and microprocessors. But from a chip manufacturing standpoint, the U.S. is losin... » read more

Week In Review: Design, Low Power


M&A Microchip Technology acquired LegUp Computing, a provider of a high-level synthesis compiler that automatically generates high-performance FPGA hardware from software. The LegUp HLS tool will be used alongside Microchip’s VectorBlox Accelerator Software Design kit and VectorBlox Neural Networking IP generator to provide a complete front-end solution stack for C/C++ algorithm develope... » read more

Defect Challenges Grow For IC Packaging


Several vendors are ramping up new inspection equipment based on infrared, optical, and X-ray technologies in an effort to reduce defects in current and future IC packages. While all of these technologies are necessary, they also are complementary. No one tool can meet all defect inspection requirements. As a result, packaging vendors may need to buy more and different tools. For years, p... » read more

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