Chiplets Enter The Supercomputer Race

By Mark LaPedus - 17 Mar, 2022 - Comments: 0

Several entities from various nations are racing each other to deliver and deploy chiplet-based exascale supercomputers, a new class of systems that are 1,000x faster than today’s supercomputers. The latest exascale supercomputer CPU and GPU designs mix and match complex dies in advanced packages, adding a new level of flexibility and customization for supercomputers. For years, various na... » read more

Technology Advances, Shortages Seen For Wire Bonders

By Mark LaPedus - 17 Feb, 2022 - Comments: 2

A surge in demand for IC packages is causing long lead times for wire bonders, which are used to assemble three-fourths of the world’s packages. The wire bonder market doubled last year, alongside advanced packaging’s rise. Wirebonding is an older technology that typically flies under the radar. Still, packaging houses have multitudes of these key tools that help assemble many — but no... » read more

Chip-Last HDFO (High-Density Fan-Out) Interposer-PoP

By Amkor - 17 Feb, 2022 - Comments: 0

Interposer Package-on-Package (PoP) technology was developed and has been in very high-volume production over the last several years for high-end mobile application processors (APs). This is due to its advantages of good package design flexibility, controllable package warpage at room temperature (25°C) and high temperature (260°C), reduced assembly manufacturing cycle time and chip-last asse... » read more

Next-Gen 3D Chip/Packaging Race Begins

By Mark LaPedus - 31 Jan, 2022 - Comments: 5

The first wave of chips is hitting the market using a technology called hybrid bonding, setting the stage for a new and competitive era of 3D-based chip products and advanced packages. AMD is the first vendor to unveil chips using copper hybrid bonding, an advanced die-stacking technology that enables next-generation 3D-like devices and packages. Hybrid bonding stacks and connects chips usin... » read more

Future Challenges For Advanced Packaging

By Mark LaPedus - 20 Jan, 2022 - Comments: 1

Michael Kelly, vice president of advanced packaging development and integration at Amkor, sat down with Semiconductor Engineering to talk about advanced packaging and the challenges with the technology. What follows are excerpts of that discussion. SE: We’re in the midst of a huge semiconductor demand cycle. What’s driving that? Kelly: If you take a step back, our industry has always ... » read more

Metal Thermal Interface Material For The Next Generation FCBGA

By Amkor - 19 Jan, 2022 - Comments: 0

Thermal interface materials (TIMs) have been widely adopted for improved thermal dissipation in flip chip ball grid array (FCBGA), flip chip lidded ball grid array (FCLGA) and flip chip pin grid array (FCPGA) packaging. As the next generation devices' requirements for power get even higher, enhanced thermal performance at the package level is increasingly important. A typical TIM applies a poly... » read more

Achieving Success In Automotive Leadframe Packages

By John Nickelsen - 22 Nov, 2021 - Comments: 0

The growth of semiconductor content in automotive applications has been accelerating. This growth drives all families of semiconductor packaging in all regions. The growth is happening in the latest advanced, laminate-based packages using flip chip interconnect as well as the venerable leadframe packages using wirebond interconnect. The automotive market consumes micro-electromechanical systems... » read more

End In Sight For Chip Shortages?

By Mark LaPedus - 18 Nov, 2021 - Comments: 2

The current wave of semiconductor and IC packaging shortages is expected to extend well into 2022, but there are also signs that supply may finally catch up with demand. The same is true for manufacturing capacity, materials and equipment in both the semiconductor and packaging sectors. Nonetheless, after a period of shortages in all segments, the current school of thought is that chip suppl... » read more

Heterogeneous Integration Using Organic Interposer Technology

By Amkor - 17 Nov, 2021 - Comments: 0

As the costs of advanced node silicon have risen sharply with the 7 and 5-nanometer nodes, advanced packaging is coming to a crossroad where it is no longer fiscally prudent to pack all desired functionality into a single die. While single-die packages will still be around, the high-end market is shifting towards multiple-die packages to reduce overall costs and improve functionality. This shif... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 12 Nov, 2021 - Comments: 0

Automotive The U.S. Congress passed an infrastructure bill that includes mandates for the U.S. automobiles to install technology in new vehicles that will stop impaired drivers from driving a vehicle. Sec. 24220, the advanced impaired driving technology section of the bill says the Secretary of Transportation is responsible for coming up with standards after which the auto industry has at the ... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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