tag: Amkor

Qualifying The ExposedPad TQFP For AEC-Q006 Grade 0
By Amkor - 15 Sep, 2021 - Comments: 0

Semiconductor packages used in various vehicle applications require high reliability. As technological innovations in the automotive market increase, the demand for highly reliable packaging is increasing for applications in autonomous driving, human interfaces, electric vehicles (EVs), hybrid electric vehicles (HEVs) and more. Package reliability is essential because automotive packages must p... » read more

Challenges With Chiplets And Packaging
By Mark LaPedus - 15 Sep, 2021 - Comments: 0

Semiconductor Engineering sat down to discuss IC packaging technology trends, chiplets, shortages and other topics with William Chen, a fellow at ASE; Michael Kelly, vice president of advanced packaging development and integration at Amkor; Richard Otte, president and CEO of Promex, the parent company of QP Technologies; Michael Liu, senior director of global technical marketing at JCET; and Th... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 10 Sep, 2021 - Comments: 0

Chipmakers, OEMs Intel plans to establish foundry capacity at its fab in Ireland. The company has also launched the so-called Intel Foundry Services Accelerator to help automotive chip designers transition from mature to advanced nodes. The company is setting up a new design team and offering both custom and industry-standard intellectual property (IP) to support the needs of automotive custom... » read more

Manufacturing Bits: Aug. 24
By Mark LaPedus - 24 Aug, 2021 - Comments: 0

Panel packaging consortium Fraunhofer Institute for Reliability and Microintegration IZM has provided an update on a consortium that is developing panel-level IC packaging technologies. Fraunhofer IZM is leading the consortium. The R&D organization and its partners, including Intel and others, have made progress in terms of equipment, processes and other technologies in the so-called Pa... » read more

Current And Future Packaging Trends
By Mark LaPedus - 19 Aug, 2021 - Comments: 1

Semiconductor Engineering sat down to discuss IC packaging technology trends and other topics with William Chen, a fellow at ASE; Michael Kelly, vice president of advanced packaging development and integration at Amkor; Richard Otte, president and CEO of Promex, the parent company of QP Technologies; Michael Liu, senior director of global technical marketing at JCET; and Thomas Uhrmann, directo... » read more

Empowering RF Front End Cellular Innovations With DSMBGA
By Curtis Zwenger - 19 Aug, 2021 - Comments: 0

With the introduction of 5G, cellular frequency bands have increased considerably, requiring innovative solutions for the packaging of RF front-end modules for smartphones and other 5G-enabled devices. Double-sided, molded ball grid array (DSMBGA) is a prime example of such solutions. “With our DSMBGA platform, we’ve established a preferred advanced packaging solution for this domain,”... » read more

Wafer-Level Fan-Out For High-Performance, Low-Cost Packaging Of Monolithic RF MEMS/CMOS
By Amkor - 18 Aug, 2021 - Comments: 0

Navigating the trade-offs between performance, size, cost and reliability can be a challenge when considering integrated circuit (IC) packaging and the end-application. The integration of micro-electromechanical systems (MEMS), either monolithic or heterogeneous, introduces yet another level of complexity that has only recently been a major focus of multi-device packaging [1]. Wafer-level fanou... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 13 Aug, 2021 - Comments: 0

Chipmakers and OEMs Samsung has announced its latest foldable smartphones--the Galaxy Z Fold3 5G and Galaxy Z Flip3 5G. The systems are based on Samsung’s 5nm application processor. One system is the company’s most affordable foldable phone. The Galaxy Z Fold3 is $1,799.99, while the Galaxy Z Flip3 is $999.99. Samsung also announced two smartwatches—the Galaxy Watch4 and Galaxy Watch4... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 30 Jul, 2021 - Comments: 0

Chipmakers Intel has outlined its new process technology roadmap with plans to regain the leadership position in the market. As part of the move, Intel has changed the way it designates the nodes, revealed its new gate-all-around (GAA) transistor, and disclosed a customer for the GAA technology--Qualcomm. And not to be outdone, Intel has broadened its packaging portfolio. Intel is changing ... » read more

Piecing Together Chiplets
By Mark LaPedus - 22 Jul, 2021 - Comments: 3

Several companies are implementing the chiplet model as a means to develop next-generation 3D-like chip designs, but this methodology still has a long way to go before it becomes mainstream for the rest of the industry. It takes several pieces to bring up a 3D chip design using the chiplet model. A few large players have the pieces, though most are proprietary. Others are missing some key co... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy