tag: Amkor

Advanced Packaging Requires Better Yield
By Ed Sperling - 17 Nov, 2016 - Comments: 1

Whether Moore's Laws truly ends, or whether the semiconductor industry reaches into the Angstrom world after 3nm—the semiconductor industry dislikes fractions—advanced packaging increasingly will dominate semiconductor designs. Apple already is on board with its iPhone 7, using TSMC's fan-out approach. And all of the major foundries and OSATs are lining up with a long list of capabilitie... » read more

Packaging Wars Begin
By Mark LaPedus - 26 Sep, 2016 - Comments: 1

The advanced IC-packaging market is turning into a high-stakes competitive battleground, as vendors ramp up the next wave of [getkc id="82" kc_name="2.5D"]/[getkc id="42" kc_name="3D"] technologies, high-density fan-out packages and others. At one time, the outsourced semiconductor assembly and test ([getkc id="83" comment="OSAT"]) vendors dominated and handled the chip-packaging requirement... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 16 Sep, 2016 - Comments: 0

Chipmakers The finFET market is heating up. GlobalFoundries, Intel, Samsung and TSMC are ramping 16nm/14nm finFETs. And 10nm and 7nm finFETs are in the works. The market will shortly have a new competitor—Taiwan’s United Microelectronics Corp. (UMC). Some years ago, UMC licensed finFET technology from IBM. UMC has been a bit quiet about the 14nm finFET technology, but it has made si... » read more

Stepping Back From Scaling
By Ed Sperling - 24 Aug, 2016 - Comments: 0

Architectures, packaging and software are becoming core areas for semiconductor research and development, setting the stage for a series of shifts that will impact a large swath of the semiconductor industry. While there is still demand from the largest chipmakers for increased density at the next process node, the underlying economics for foundries, equipment vendors and IP developers are f... » read more

China’s Capital Equipment Market To Boom
By Jeff Dorsch - 18 Aug, 2016 - Comments: 1

The worldwide semiconductor capital equipment market declined 3% last year to $36.53 billion from 2014’s $37.5 billion, but inside China the story was significantly different. Capital equipment sales there increased by 12% in 2015, to $4.9 billion. In fact, only Japan showed a higher growth rate last year, of 31%, according to figures from [getentity id="22821" comment="SEMI"] and the Semi... » read more

Data Analytics To Drive IC Shift
By Paula Doe - 28 Jun, 2016 - Comments: 0

The adoption of predictive analytics has the potential to drive the next round of IC industry innovation and growth. Much of the necessary data handling technology is now available from other sectors. However, to fully capitalize on the possibilities, the IC manufacturing world faces particular challenges in figuring out how to get a high yield of actionable information from its streams of vari... » read more

Foundries Expand Their Scope
By Ed Sperling - 21 Apr, 2016 - Comments: 0

By Ed Sperling & Mark LaPedus Major foundries are stepping up their offerings across a wide swath of technology nodes, specialty processes and advanced packaging—a recognition that end markets are fragmenting and that the path forward includes a mix of new and established processes. As the smart phone market flattens, there is no single "next big thing" to drive volume at the most ... » read more

Consolidation Hits OSAT Biz
By Mark LaPedus - 18 Feb, 2016 - Comments: 0

The outsourced semiconductor assembly and test (OSAT) industry is undergoing a new wave of acquisition activity that will dramatically reshape the packaging and test services markets. [getkc id="83" kc_name="OSATs"] have seen a considerable amount of consolidation over the years, but the industry needs a scorecard to keep track of the recent deals and the resulting fallout. One OSAT deal inv... » read more

Inside Advanced Packaging
By Mark LaPedus - 18 Feb, 2016 - Comments: 0

Semiconductor Engineering sat down to discuss advanced IC-packaging, the OSAT industry, China and other topics with Ron Huemoeller, vice president of worldwide R&D at Amkor. What follows are excerpts of that conversation. SE: Where are we in advanced IC-packaging today? Huemoeller: We’ve hit the inflection point. Now we are coming to the other side of it. Regarding this need to int... » read more

Advanced Packaging Is Real. Now What?
By Ed Sperling - 14 Jan, 2016 - Comments: 0

For the past five years, it's been clear that 2.5D, fan-outs and other forms of system-in-package were on the horizon. Exactly when they would arrive no one knew. The most common prediction was that the timing would depend on when one of the big chipmakers decided to go down that route. The theory was that the remainder of the industry would follow, ecosystem issues would be sorted out—partic... » read more

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