tag: analog

Rotating neurons for all-analog implementation of cyclic reservoir computing
By Technical Paper Link - 23 Mar, 2022 - Comments: 0

Abstract "Hardware implementation in resource-efficient reservoir computing is of great interest for neuromorphic engineering. Recently, various devices have been explored to implement hardware-based reservoirs. However, most studies were mainly focused on the reservoir layer, whereas an end-to-end reservoir architecture has yet to be developed. Here, we propose a versatile method for implemen... » read more

Reliability Concerns Shift Left Into Chip Design
By Ann Mutschler - 22 Dec, 2021 - Comments: 1

Demand for lower defect rates and higher yields is increasing, in part because chips are now being used for safety- and mission-critical applications, and in part because it's a way of offsetting rising design and manufacturing costs. What's changed is the new emphasis on solving these problems in the initial design. In the past, defectivity and yield were considered problems for the fab. Re... » read more

Enabling Training of Neural Networks on Noisy Hardware
By Technical Paper Link - 18 Nov, 2021 - Comments: 0

Abstract:  "Deep neural networks (DNNs) are typically trained using the conventional stochastic gradient descent (SGD) algorithm. However, SGD performs poorly when applied to train networks on non-ideal analog hardware composed of resistive device arrays with non-symmetric conductance modulation characteristics. Recently we proposed a new algorithm, the Tiki-Taka algorithm, that overcomes t... » read more

Functional Safety Across Analog And Digital Domains
By Frank Schirrmeister - 28 Oct, 2021 - Comments: 1

The autonomy of vehicles has been all the rage recently. There are different levels of autonomous driving, with level 5 “Full Automation” being the target the industry is working towards, and Level 2 “Partial Automation” and Level 3 “Conditional Automation” being the level at which the automotive sector currently delivers the most technology. The amount of electronics in cars has be... » read more

3D Printing For More Circuits
By Ann R. Thryft - 27 Oct, 2021 - Comments: 0

After several years of experimentation, and growing success in volume manufacturing for some use cases, technologies for 3D printing of electronic circuits are becoming more common. Some innovations in processes and materials are moving these technologies closer to mainstream electronics manufacturing. Christopher Tuck, professor of material science at the University of Nottingham, observed ... » read more

Challenges In RF Design
By Roland Jancke - 14 Oct, 2021 - Comments: 0

Designing highly integrated components for radio frequency applications poses special challenges for system engineers, designers and the commissioning engineers. The boundary between chip, package and board is increasingly vanishing on modern components. It is growing more common for parts of the functionality to be moved to the package or even the board. In some cases, the requirements have be... » read more

Bringing Scalable Power Integrity Analysis To Analog IC Designs
By Joe Davis - 14 Oct, 2021 - Comments: 0

Power integrity is a broad term in integrated circuit (IC) design and verification. However, when IC engineers are working through design signoff, power integrity analysis focuses on three specific aspects of a design: Power: Verify the chip design as implemented provides the total predicted power under different operating modes. Performance: Find and eliminate performance issues affect... » read more

Faster Analog Design Closure With Early Parasitic Analysis Flow – Part 1
By Synopsys - 22 Sep, 2021 - Comments: 0

In part 1 of this series, Denis Goinard, Director of Engineering at Synopsys, discusses how Synopsys provides a unified workflow to accurately estimate, measure, extract and simulate parasitics by bringing signoff tools into the design process, enabling faster design convergence. Click here to play the video. Note: This is a Synopsys 'video white paper.' For more video white papers, click h... » read more

System-In-Package Thrives In The Shadows
By Mark LaPedus - 16 Sep, 2021 - Comments: 0

IC packaging continues to play a big role in the development of new electronic products, particularly with system-in-package (SiP), a successful approach that continues to gain momentum — but mostly under the radar because it adds a competitive edge. With a SiP, several chips and other components are integrated into a package, enabling it to function as an electronic system or sub-system. ... » read more

Wrestling With Analog At 3nm
By Brian Bailey - 09 Sep, 2021 - Comments: 0

Analog engineers are facing big challenges at 3nm, forcing them to come up with creative solutions to a widening set of issues at each new process node. Still, these problems must be addressed, because no digital chip will work without at least some analog circuitry. As fabrication technologies shrink, digital logic improves in some combination of power, performance, and area. The process te... » read more

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