Big Problems In A Little Data World

By Keren Kanarik - 19 Mar, 2020 - Comments: 0

Lam Executive Vice President and Chief Technology Officer, Richard A. Gottscho, gave a keynote at the SEMI Industry Strategy Symposium (ISS), the annual executive conference for the semiconductor industry. Titled “I’m Living in a Little Data World, but I Have a Big Problem,” Rick talked about the challenges faced by the “little data world” of process development and the potential for ... » read more

Using Machine Learning To Gain Data Insights

By Alex Burlak - 11 Feb, 2020 - Comments: 0

Today’s consumers have little appetite for networks that go down, for electronic devices that fail, and for any kind of digital service that doesn’t deliver as promised every time. Reliability is no longer a nice-to-have. It's a key feature. The continued scaling of advanced electronics and chip manufacturing technologies, however, makes reliability harder to achieve — even as expectati... » read more

Making 3D Structures And Packages More Reliable

By Ed Sperling - 14 Jan, 2020 - Comments: 0

The move to smaller vertical structures and complex packaging schemes is straining existing testing approaches, particularly in heterogeneous combinations on a single chip and in multi-die packages. The complexity of these devices has exploded with the slowdown in scaling, as chipmakers turn to architectural solutions and new transistor structures rather than just relying on shrinking featur... » read more

Three Levers for Accelerating Lightweighting in Aerospace: Advanced Materials, Additive Manufacturing, Materials Intelligence

By Ansys - 11 Dec, 2019 - Comments: 0

Accelerating the delivery of lighter weight aircraft is possible by focusing on three key levers: more extensive use of advanced materials, broader adoption of new manufacturing techniques and extraction of more value from existing materials data. This white paper delves into the opportunities and challenges presented by each, and provides best practices for reducing fuel costs and emissions th... » read more

Reliability At 5nm And Below

By Ed Sperling - 10 Dec, 2019 - Comments: 2

The best way to figure out how a chip or package will age is to bake it in an oven, heat it in a pressure cooker, and stick it in a freezer. Those are all standard methods to accelerate physical effects and the effects of aging, but it's not clear they will continue working as chips shrink to 5nm and 3nm, or as they are included in multi-die packages. Extending any of those kitchen-like appr... » read more

Improving Reliability Monitoring Of High-Bandwidth Memory

By Eyal Fayneh - 10 Dec, 2019 - Comments: 0

As the quest for increased bandwidth and speed continues, multi-die technologies with advanced memory architectures are introduced. As the complexity of these heterogenous packaging continues to develop, new reliability challenges arise. A new approach to HBM subsystem monitoring and repair provides advanced in-field reliability assurance. By applying analytics to data created by on-chip Age... » read more

November 2019 Startup Funding

By Jeff Dorsch - 05 Dec, 2019 - Comments: 0

During November, 16 tech startups raised private funding rounds of $100 million or more, together receiving $3.42 billion. Investors were drawn to many of the same technology fields that were popular in 2019 — automotive and mobility tech, artificial intelligence and machine learning, cybersecurity, platforms, semiconductors, and software. Analytics of multiple different types were big in ... » read more

Verification In The Era Of Autonomous Driving, Artificial Intelligence And Machine Learning

By Frank Schirrmeister - 26 Nov, 2019 - Comments: 0

The last couple of weeks have been busy with me participating on three panels that dealt with AI and machine learning in the contexts of automotive and aero/defense, in San Jose, Berlin and Detroit. The common theme? Data is indeed the new oil, and it messes with traditional value creation in electronics. Also, requirements for system design and verification are changing and there are completel... » read more

Changes In Data Storage and Usage

By Ed Sperling - 09 Oct, 2019 - Comments: 0

Doug Elder, vice president and general manager of OptimalPlus, talks about what’s changing in the storage and collection, including using data lakes and data engineering to break down silos and get data into a consistent format, and why it’s essential to define data up front based upon how quickly it needs to be accessed, as well as who actually owns the data. » read more

Testing Against Changing Standards In Automotive

By Ed Sperling and Kevin Fogarty - 08 Oct, 2019 - Comments: 0

The infusion of more semiconductor content into cars is raising the bar on reliability and changing the way chips are designed, verified and tested, but it also is raising a lot of questions about whether companies are on the right track at any point in time. Concerns about liability are rampant with autonomous and assisted driving, so standards are being rolled out well in advance of the te... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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