tag: ANSYS

Blog Review: Aug. 17
By Jesse Allen - 17 Aug, 2022 - Comments: 0

Synopsys' Steve Pateras explains the basics of silicon lifecycle management and how it can help monitor, analyze, and optimize both semiconductor and end-user systems throughout the product value chain, from design and manufacturing to testing and maintenance. Siemens' Heather George considers the current state of 3D chiplet-based designs and efforts to standardize chiplet models and deliver... » read more

Security Research: Technical Paper Round-Up
By Linda Christensen - 16 Aug, 2022 - Comments: 0

A number of hardware security-related technical papers were presented at recent conferences, including the August 2022 USENIX Security Symposium and IEEE’s International Symposium on Hardware Oriented Security and Trust (HOST). Topics include side-channel attacks and defenses (including on-chip mesh interconnect attacks), heterogeneous attacks on cache hierarchies, rowhammer attacks and mitig... » read more

A Glimpse Into Deep Space With Extreme Optical Engineering
By Erik Ferguson - 11 Aug, 2022 - Comments: 0

By Daewook Kim and Erik Ferguson In the past few decades, optical science has pushed far beyond the foundations originally laid by Galileo and Newton 400 years ago. The planned deployment of new ground- and space-based telescopes dedicated to seeing farther into deep space in more detail than ever before will provide astronomers with increased opportunities to find Earth-like exoplanets and ... » read more

Blog Review: Aug. 10
By Jesse Allen - 10 Aug, 2022 - Comments: 0

Siemens' Heather George provides a primer on 3D IC, including the problems it is trying to solve, what differentiates it from other multi-chip technologies, and some of the unique challenges in 3D integration. Cadence's Paul McLellan shares highlights from the Automobil Elektronik Kongress, including how the increasing amount of software in a car is driving disruption in the automotive suppl... » read more

The Value Of High-Performance Computing For Simulation
By Ansys - 10 Aug, 2022 - Comments: 0

This white paper breaks down the costs and time savings associated with implementing high-performance computing technology. High-performance computing (HPC) is an enormous part of the present and future of engineering simulation. HPC allows best-in-class companies to gain high-fidelity insight into product behavior, insight that cannot be obtained without the detailed simulation models – i... » read more

Assessing & Simulating Semiconductor Side-Channel or Unintended Data Leakage Vulnerabilities
By Technical Paper Link - 09 Aug, 2022 - Comments: 0

This research paper titled "Multiphysics Simulation of EM Side-Channels from Silicon Backside with ML-based Auto-POI Identification" from researchers at Ansys, National Taiwan University and Kobe University won the best paper award at IEEE's International Symposium on Hardware Oriented Security and Trust (HOST). The paper presents a new tool "to assess unintended data leakage vulnerabilities... » read more

Week In Review: Design, Low Power
By Marie C. Baca - 05 Aug, 2022 - Comments: 0

Quantum Computing Researchers in China are putting a damper on Google’s claims of achieving quantum supremacy after they were able to use normal processors to complete a difficult calculation in a few hours. Sycamore, Google’s quantum computer, completed the same calculation in a few minutes back in 2019, but the company said it would take a supercomputer more than 10,000 years to do the... » read more

Is Standardization Required For Security?
By Ann Mutschler - 04 Aug, 2022 - Comments: 1

Semiconductor Engineering sat down to discuss chip and system security with Mike Borza, fellow and scientist on the security IP team at Synopsys; Lee Harrison, automotive IC test solutions manager at Siemens Digital Industries Software; Jason Oberg, founder and CTO of Cycuity (formerly Tortuga Logic); Nicole Fern, senior security analyst at Riscure; Norman Chang, fellow and CTO of the electroni... » read more

Blog Review: Aug. 3
By Jesse Allen - 03 Aug, 2022 - Comments: 0

Siemens' Patrick Hope explains the growing importance of choosing the right laminate for PCB designs and how to read a material datasheet to compare important electrical, thermal, and mechanical properties. Synopsys' Yankin Tanurhan argues that as the number of sensors being integrated in automotive systems increases to enable new ADAS and autonomy capabilities, building security and quality... » read more

Week In Review, Design, Low Power
By Marie C. Baca - 29 Jul, 2022 - Comments: 0

Financial News Cadence announced second quarter revenue of $858 million, an increase of 17.9% compared with the same period a year ago when revenue was $728 million. President and CEO Anirudh Devgan said the company’s results are “emblematic of the megatrends of the long-term strength of semis, systems companies investing more in silicon, and the convergence of system and chip designs.�... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy