Week In Review: Design, Low Power


Tools & IP Ansys updated its product suite, adding new tools and workflows in Ansys 2022 R1. It adds Phi Plus meshing technology to improve simulation of PCB and complex 3D IC packaging. It also introduces RedHawk-SC SigmaDVD, a statistically realistic modeling technique to identify the worst-case dynamic voltage-drop in hours and make it possible to achieve near 100% coverage of all relev... » read more

Week In Review: Auto, Security, Pervasive Computing


Pervasive computing, IoT and 5G The U.S. company SpaceX deployed more satellites into LEO (low earth orbit) Starlink constellation and launched a premium service for businesses that costs $500 a month, bringing download speeds of 150-500 Mbps and latency of 20-40ms. The regular Starlink service is $99 a month. Starlink has launched over 2,000 satellites into its constellation, according to sta... » read more

Data Security Challenges In Automotive


Automakers are scrambling to prevent security breaches and data hacks in new vehicles while simultaneously adding new and increasingly autonomous features into vehicles that can open the door to new vulnerabilities. These two goals are often at odds. As with security in any complex system, nothing is ever completely secure. But even getting a handle on this multilayered issue is a challenge.... » read more

Blog Review: Feb. 2


Synopsys' Stelios Diamantidis shares some predictions for AI in 2022, including the three markets that will push new AI chips, the increasing need for trust chains, the entry of non-traditional companies, and the impact of AI in chip design. Siemens EDA's Ray Salemi checks out how Python and SystemVerilog can work together to boost the verification ecosystem by taking advantage of what each ... » read more

Week In Review: Design, Low Power


Kalray, a provider of programmable data processing and storage acceleration cards for data centers, will acquire Arcapix Holdings, which provides software-defined storage and data management solutions for data-intensive applications. "I am delighted at the prospect of this acquisition that will accelerate our go-to-market and strengthen our key position in the data-intensive storage market. It ... » read more

Week In Review: Auto, Security, Pervasive Computing


China’s regulators are agreeing to AMD’s acquisition of Xilinx with the caveat that AMD must agree not to force tie-in sales Xilinx's products with AMD products, according to Reuters. China's State Administration for Market Regulation said the companies cannot discriminate against customers using other technology. Xilinx's SEC 8-K form confirms that the two companies received clearance for ... » read more

Blog Review: Jan. 26


Arm's Mark Inskip shares how the Morello prototype architecture, aimed at improving the security of hardware, was developed, from the creation of the prototype architecture specification, followed by the design and implementation of a new CPU, through to the development of a new SoC, hardware platform, development tools, toolchains, and software. Cadence's Paul McLellan looks at how the RISC... » read more

Blog Review: Jan. 19


Synopsys' Anand Thiruvengadam examines the memory chip design challenges of optimizing PPA, speeding turnaround time, and improving reliability and how a shift-left approach can help. Cadence's Paul McLellan checks out some of TSMC's recent updates in 3D packaging and the importance of thermal analysis and finding the right balance between IR-drop and TSV usage in multi-chip physical verific... » read more

SuperGrid Institute Responds to Energy and Climate Demands


Researchers and developers at SuperGrid Institute use Ansys electronics software solutions to perform studies on power converters, critical links in the chain between electric generators and consumers, for their clients. Fig. 1: Medium-voltage DC grid power supply topology. As an independent research and innovation institute based in France, SuperGrid Institute is dedicated to developin... » read more

High-Tech: Innovation At The Speed of Light


As connectivity, digitalization, and autonomy proliferate, the boundaries between industries are blurring at an unprecedented pace. Promising to unleash $3TN in global technology market spending, the new competitive battleground is to be found where the system electronics and semiconductor worlds collide: The 3D Integrated Circuit System-on-a-Chip. Winning demands a new design paradigm that ... » read more

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