tag: Apple

Wirebond Technology Rolls On
By Mark LaPedus - 08 May, 2017 - Comments: 2

Several years ago, many predicted the demise of an older interconnect packaging technology called wire bonding, prompting the need for more advanced packaging types. Those predictions were wrong. The semiconductor industry today uses several advanced packaging types, but wire bonding has been reinvented over the years and remains the workhorse in packaging. For example, Advanced Semiconducto... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 05 May, 2017 - Comments: 0

Fab tools, test and packaging Brewer Science has sold its so-called Cee semiconductor processing equipment business. A former employee, Russ Pagel, has formed a new company, Cost Effective Equipment, to take over ownership and operate the Cee business. The new company, which will remain in Rolla, Mo., will sell spin coaters, bake plates, bonders and other systems. Taiwan’s Ministry of E... » read more

The Week In Review: Design
By Jesse Allen - 05 May, 2017 - Comments: 0

Imagination has put the MIPS embedded processor and Ensigma mobile connectivity groups up for sale, refocusing on graphics after last month's announcement that Apple would no longer use the company's GPU IP. Imagination also began formal dispute resolution procedures with Apple. Tools Synopsys released new versions of its HSPICE, FineSim and CustomSim circuit simulation products, adding n... » read more

22nm Process War Begins
By Mark LaPedus - 23 Apr, 2017 - Comments: 1

Many foundry customers at the 28nm node and above are developing new chips and are exploring the idea of migrating to 16nm/14nm and beyond. But for the most part, those companies are stuck because they can’t afford the soaring IC design costs at advanced nodes. Seeking to satisfy a potential gap in the market, [getentity id="22819" comment="GlobalFoundries"], [getentity id="22846" e_name="... » read more

Moore’s Law: A Status Report
By Ed Sperling - 20 Apr, 2017 - Comments: 3

Moore's Law has been synonymous with "smaller, faster, cheaper" for the past 52 years, but increasingly it is viewed as just one of a number of options—some competing, some complementary—as the chip industry begins zeroing in on specific market needs. This does not make [getkc id="74" comment="Moore's Law"] any less relevant. The number of companies racing from 16/14nm to 7nm is higher t... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 14 Apr, 2017 - Comments: 0

Fab equipment and test VLSI Research has released its top 10 semiconductor equipment supplier ranking in terms of sales in 2016. Applied Materials topped the list again, achieving a growth of 18%. ASML was second, followed by Lam Research, TEL and KLA-Tencor. Fig. 1: Ranking based on 2016 sales. Source: VLSI Research. Unic Capital Management, a Chinese-based private equity fund, announ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 07 Apr, 2017 - Comments: 0

Mask and fab equipment Seeking to speed up the semiconductor design and manufacturing process, D2S has rolled out its fifth-generation computational design platform (CDP). D2S, a supplier of GPU-accelerated computational systems or platforms, said the latest CDP is designed to enable faster simulations for a range of applications. Using Nvidia’s Pascal-based Tesla P40 GPUs, D2S’ fifth-... » read more

The Week In Review: Design
By Jesse Allen - 07 Apr, 2017 - Comments: 0

Name Changes Arteris changed its name to ArterisIP. The company said the name change better reflects what the company does, which is provide IP for SoC communication on-die and between die. Mentor Graphics also modified its name, following last week's announcement that the acquisition by Siemens has been completed. The company is now officially called Mentor, A Siemens Business. It also ... » read more

Pushing Batteries Too Far?
By Ed Sperling - 06 Apr, 2017 - Comments: 0

Reports of battery fires in consumer devices are not abating. The culprit in almost all cases is the lithium-ion battery. In some cases, this is a manufacturing issue, where predictable intervals of failure can point to a breach in the membrane separating the anode and cathode or a metal particle contaminant that causes a short circuit. Those kinds of flaws are well understood, based upon ho... » read more

IoT Security Risks Grow
By Ed Sperling - 30 Mar, 2017 - Comments: 0

Semiconductor Engineering sat down to discuss security issues with Asaf Shen, vice president of marketing for security IP in [getentity id="22186" e_name="ARM's"] Systems & Software Group; Timothy Dry, principal staff marketing manager for the Industrial IoT segment at [getentity id="22819" comment="GlobalFoundries"]; Chowdary Yanamadala, senior vice president of business development at Cha... » read more

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