tag: Applied Materials

Blog Review: Oct. 30
By Jesse Allen - 30 Oct, 2019 - Comments: 0

Cadence's Paul McLellan checks out the future of the automotive industry, the options for making the transition to autonomous driving, and how experience with electric vehicles influences perception of them. In a video, Mentor's Colin Walls digs into the challenges of testing memory in an embedded system. A Synopsys writer looks at doubling bandwidth in PCIe 5.0, the PHY logical changes a... » read more

Power Semi Wars Begin
By Mark LaPedus - 23 Oct, 2019 - Comments: 1

Several vendors are rolling out the next wave of power semiconductors based on gallium nitride (GaN) and silicon carbide (SiC), setting the stage for a showdown against traditional silicon-based devices in the market. Power semiconductors are specialized transistors that incorporate different and competitive technologies like GaN, SiC and silicon. Power semis operate as a switch in high-volt... » read more

Making Random Variation Less Random
By Ed Sperling - 21 Oct, 2019 - Comments: 0

The economics for random variation are changing, particularly at advanced nodes and in complex packaging schemes. Random variation always will exist in semiconductor manufacturing processes, but much of what is called random has a traceable root cause. The reason it is classified as random is that it is expensive to track down all of the various quirks in a complex manufacturing process or i... » read more

A Quantum Future Approaches
By Kenichi Ohno - 17 Oct, 2019 - Comments: 0

By Kenichi Ohno, Robert Visser, and Nir Yahav We often think quantum technology is a far-off future. Thanks to decades-long research on the elemental technologies and recent breakthroughs, the emergence of quantum may happen sooner than later. Large enterprises, start-ups, government agencies and research organizations around the world are investing billions of dollars to scale quantum techn... » read more

Building An MRAM Array
By Katherine Derbyshire - 17 Oct, 2019 - Comments: 2

MRAM is gaining traction in a variety of designs as a middle-level type of memory, but there are reasons why it took so long to bring this memory to market. A typical magnetoresistive RAM architecture is based on CoFeB magnetic layers, with an MgO tunneling barrier. The reference layer should have zero net magnetization to make sure that it doesn’t influence the orientation of the free lay... » read more

Are You Running Your Equipment Or Is Your Equipment Running You?
By Applied Materials - 16 Oct, 2019 - Comments: 0

Applied Materials, the innovator of the SmartFactory Rx suite of software products, is taking the lead on leveraging Industry 4.0 principles and technologies, such as Industrial Internet of Things (IIoT) and advanced analytics, to optimize manufacturing process performance, asset utilization, and supply chain. SmartFactory Rx Analytics & Control (A&C) collects real-time data from interconnect... » read more

Blog Review: Oct. 16
By Jesse Allen - 16 Oct, 2019 - Comments: 0

Arm's Greg Yeric dives into the challenges facing the semiconductor industry and potential solutions that could possibly have huge impacts toward the year 2030, from DNA self-assembly to new physics, in an adaptation of his wide-ranging Arm TechCon keynote. Cadence's Paul McLellan considers Google's recent quantum computing achievement, what quantum supremacy really means, and where it leave... » read more

Blog Review: Oct. 9
By Jesse Allen - 09 Oct, 2019 - Comments: 0

In a video, Cadence's Tom Hackett continues his introduction to finite element analysis (FEA) and the important role it can play in electronics deign. Mentor's Colin Walls considers dynamic memory allocation in real-time operating systems and the problems of non-deterministic behavior and ill-defined failure modes. Synopsys' Taylor Armerding contends that ethical hackers are a necessary p... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 20 Sep, 2019 - Comments: 0

Fab tools The confidence level of extreme ultraviolet (EUV) lithography continues to grow as the technology moves into production, but the EUV mask infrastructure remains a mixed picture, according to new surveys released by the eBeam Initiative. D2S has developed new hardware and software that enables a long-awaited technology--full-chip masks using inverse lithography technology (ILT). ... » read more

Challenges Grow For Finding Chip Defects
By Mark LaPedus - 19 Sep, 2019 - Comments: 5

Several equipment makers are developing or ramping up a new class of wafer inspection systems that address the challenges in finding defects in advanced chips. At each node, the feature sizes of the chips are becoming smaller, while the defects are harder to find. Defects are unwanted deviations in chips, which impact yield and performance. The new inspection systems promise to address the c... » read more

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