tag: Applied Materials

200mm Equipment Shortfall
By Mark LaPedus - 21 Jul, 2016 - Comments: 0

A surge in demand for consumer electronics, communications ICs, sensors and other products has created a shortage in 200mm fab capacity that shows no signs of abating. None of these chips need to be manufactured using the most advanced processes, and there have been enough tweaks to processes at established nodes to eke even more out of existing processes. But that has left chipmakers strugg... » read more

Blog Review: July 20
By Jesse Allen - 20 Jul, 2016 - Comments: 0

Applied's Er-Xuan Ping addresses the challenges facing materials and processing in a changing memory landscape, and the opportunities that may arise. Cadence's Paul McLellan looks at teaching neural networks to perceive things more like humans do, through German traffic signs. Mentor's Colin Walls digs into managing timing and peripherals in embedded systems. Synopsys' Robert Vamosi ch... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 15 Jul, 2016 - Comments: 0

Fab and test equipment The wafer inspection market is heating up. For example, Applied Materials announced its new e-beam inspection system for use in foundry, logic, DRAM and 3D NAND applications. In addition, KLA-Tencor introduced six wafer defect inspection and review systems for leading-edge IC device manufacturing. National Instruments has rolled out a second-generation vector sig... » read more

E-beam Vs. Optical Inspection
By Mark LaPedus - 11 Jul, 2016 - Comments: 0

The wafer inspection business is heating up as chipmakers encounter new and tiny killer defects in advanced devices. Last month ASML Holding entered into an agreement to acquire Hermes Microvision (HMI), the world’s largest e-beam inspection vendor, for $3.1 billion. The proposed move propelled ASML into the e-beam wafer inspection market. In addition, [getentity id="22817" e_name="Appl... » read more

Blog Review: July 6
By Jesse Allen - 06 Jul, 2016 - Comments: 0

Cadence's Chris Rowen discusses optimizing neural networks for low-energy and high-throughput applications in his latest video. What should you include in an IoT chip? Synopsys' Eric Huang presents the case for building in USB. Mentor's Matthew Hogan takes a look at what's needed for speedy interconnect robustness verification. Rambus' Aharon Etengoff digs into a potential new enterpri... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 01 Jul, 2016 - Comments: 0

Fab tools Applied Materials has officially rolled out the Producer Selectra system, a selective etch tool. The system falls under the loosely defined category called atomic layer etch (ALE). Applied’s technology addresses a number of challenges. Today’s advanced chips have complex structures. They may also have deep and narrow trenches. One of the challenges is the inability of wet ... » read more

Atomic Layer Etch Heats Up
By Mark LaPedus - 29 Jun, 2016 - Comments: 0

The atomic layer etch (ALE) market is starting to heat up as chipmakers push to 10nm and beyond. ALE is a promising next-generation etch technology that has been in R&D for the last several years, but until now there has been little or no need to use it. Unlike conventional etch tools, which remove materials on a continuous basis, ALE promises to selectively and precisely remove targete... » read more

Blog Review: June 29
By Jesse Allen - 29 Jun, 2016 - Comments: 0

Ansys' Justin Nescott checks out the world's first electric highway for trucking in this week's top five tech picks. Plus, some cool houses, Boston Dynamics' giraffe-bot, and a drum kit in a backpack. Applied's Matt Cogorno takes a look at the challenges facing etch methods as devices keep getting smaller. Synopsys' Apoorva Mathur digs into the energy efficient aspects of the MIPI M-PHY a... » read more

Data Analytics To Drive IC Shift
By Paula Doe - 28 Jun, 2016 - Comments: 0

The adoption of predictive analytics has the potential to drive the next round of IC industry innovation and growth. Much of the necessary data handling technology is now available from other sectors. However, to fully capitalize on the possibilities, the IC manufacturing world faces particular challenges in figuring out how to get a high yield of actionable information from its streams of vari... » read more

Interconnect Challenges Rising
By Mark LaPedus - 27 Jun, 2016 - Comments: 1

Chipmakers are ramping up their 14nm finFET processes, with 10nm and 7nm slated to ship possibly later this year or next. At 10nm and beyond, IC vendors are determined to scale the two main parts of the [getkc id="185" kc_name="finFET"] structure—the transistor and interconnects. Generally, transistor scaling will remain challenging at advanced nodes. And on top of that, the interconnects ... » read more

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