Chip Industry Technical Paper Roundup: May 20


New technical papers recently added to Semiconductor Engineering’s library: [table id=432 /] Find more semiconductor research papers here. » read more

Chip Industry Week in Review


Check out the Inside Chips podcast for our behind-the-scenes analysis. Newly proposed U.S. legislation called the Chip Security Act would use location verification tracking as a tool to help combat chip smuggling. This follows a report by the Economist that showed Taiwan exports of advanced chips to Malaysia in the first quarter has nearly reached 2024 totals, heightening concerns that China... » read more

Floorplanning Method For Reducing Thermally-Induced Structural Stress In Chiplet Packages (Penn State, Intel, ASU et al.)


A new technical paper titled "STAMP-2.5D: Structural and Thermal Aware Methodology for Placement in 2.5D Integration" was published by researchers at Pennsylvania State University, Intel, Arizona State University and University of Notre Dame. Abstract "Chiplet-based architectures and advanced packaging has emerged as transformative approaches in semiconductor design. While conventional ph... » read more

Chip Industry Technical Paper Roundup: Apr. 29


New technical papers recently added to Semiconductor Engineering’s library: [table id=424 /] Find more semiconductor research papers here. » read more

Controlled Shared Memory For Dynamically Controlling Data Communication Via Shared Memory Approaches (ASU, Intel)


A new technical paper titled "Controlled Shared Memory (COSM) Isolation: Design and Testbed Evaluation" was published by researchers at Arizona State University and Intel Corporation. Abstract "Recent memory sharing approaches, e.g., based on the Compute Express Link (CXL) standard, allow the flexible high-speed sharing of data (i.e., data communication) among multiple hosts. In information... » read more

Chip Industry Week in Review


To listen to the podcast version, click here. TSMC unveiled an unusually detailed roadmap at this week's North America Technology Symposium, including future architectures for 3D-ICs for high-performance computing and small, extremely low-power chips for AR/VR glasses, and two implementations of system-on-wafer. Fig. 1: TSMC's future packaging and stacking roadmap. Source: TSMC The ... » read more

Chip Industry Technical Paper Roundup: Apr. 1


New technical papers recently added to Semiconductor Engineering’s library: [table id=416 /] Find more semiconductor research papers here. » read more

Evaluation Tool For The Cost Impacts Of Chiplet-Specific Design Choices


A new technical paper titled "CATCH: a Cost Analysis Tool for Co-optimization of chiplet-based Heterogeneous systems" was published by researchers at UCLA, Duke University and Arizona State University. Abstract "With the increasing prevalence of chiplet systems in high-performance computing applications, the number of design options has increased dramatically. Instead of chips defaulting to... » read more

Defect Analysis and Testing Framework For FOWLP Interconnects


A new technical paper titled "Defect Analysis and Built-In-Self-Test for Chiplet Interconnects in Fan-out Wafer-Level Packaging" was published by researchers at Arizona State University. Abstract "Fan-out wafer-level packaging (FOWLP) addresses the demand for higher interconnect densities by offering reduced form factor, improved signal integrity, and enhanced performance. However, FOWLP fa... » read more

Chip Industry Technical Paper Roundup: Feb. 18


New technical papers recently added to Semiconductor Engineering’s library: [table id=406 /] Find all technical papers here. » read more

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