tag: Arizona State University

Chip Industry Technical Paper Roundup: Apr. 29
By Linda Christensen - 29 Apr, 2025 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=424 /] Find more semiconductor research papers here. » read more

Controlled Shared Memory For Dynamically Controlling Data Communication Via Shared Memory Approaches (ASU, Intel)
By Technical Paper Link - 27 Apr, 2025 - Comments: 0

A new technical paper titled "Controlled Shared Memory (COSM) Isolation: Design and Testbed Evaluation" was published by researchers at Arizona State University and Intel Corporation. Abstract "Recent memory sharing approaches, e.g., based on the Compute Express Link (CXL) standard, allow the flexible high-speed sharing of data (i.e., data communication) among multiple hosts. In information... » read more

Chip Industry Week in Review
By The SE Staff - 25 Apr, 2025 - Comments: 0

To listen to the podcast version, click here. TSMC unveiled an unusually detailed roadmap at this week's North America Technology Symposium, including future architectures for 3D-ICs for high-performance computing and small, extremely low-power chips for AR/VR glasses, and two implementations of system-on-wafer. Fig. 1: TSMC's future packaging and stacking roadmap. Source: TSMC The ... » read more

Chip Industry Technical Paper Roundup: Apr. 1
By Linda Christensen - 01 Apr, 2025 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=416 /] Find more semiconductor research papers here. » read more

Evaluation Tool For The Cost Impacts Of Chiplet-Specific Design Choices
By Technical Paper Link - 25 Mar, 2025 - Comments: 0

A new technical paper titled "CATCH: a Cost Analysis Tool for Co-optimization of chiplet-based Heterogeneous systems" was published by researchers at UCLA, Duke University and Arizona State University. Abstract "With the increasing prevalence of chiplet systems in high-performance computing applications, the number of design options has increased dramatically. Instead of chips defaulting to... » read more

Defect Analysis and Testing Framework For FOWLP Interconnects
By Technical Paper Link - 24 Mar, 2025 - Comments: 0

A new technical paper titled "Defect Analysis and Built-In-Self-Test for Chiplet Interconnects in Fan-out Wafer-Level Packaging" was published by researchers at Arizona State University. Abstract "Fan-out wafer-level packaging (FOWLP) addresses the demand for higher interconnect densities by offering reduced form factor, improved signal integrity, and enhanced performance. However, FOWLP fa... » read more

Chip Industry Technical Paper Roundup: Feb. 18
By Linda Christensen - 18 Feb, 2025 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=406 /] Find all technical papers here. » read more

FOWLP Warpage: Review Of Causes, Modeling And Methodologies For Controlling
By Technical Paper Link - 14 Feb, 2025 - Comments: 0

A new technical paper titled "Warpage in wafer-level packaging: a review of causes, modelling, and mitigation strategies" was published by researchers at Arizona State University. Abstract "Wafer-level packaging (WLP) is a pivotal semiconductor packaging technology that enables heterogeneously integrated advanced semiconductor packages with high-density electrical interconnections through i... » read more

Universities Augment Engineering Curricula To Boost Employability
By Liz Allan - 05 Feb, 2025 - Comments: 0

Increasing numbers of universities are offering semiconductor courses in their engineering programs, and also in math, physics, and business degrees. Most universities now offer a broad foundation so students can pivot to other industries during cyclical downturns, or when technology and science create entirely new and potentially lucrative opportunities, such as generative AI, advanced pack... » read more

Chip Industry Week In Review
By The SE Staff - 24 Jan, 2025 - Comments: 0

The new Trump administration was quick to put a different stamp on the tech world: President Trump rescinded a long list of Biden’s executive orders, including those aimed at AI safety and the mandate for 50% EVs by 2030. Roughly 1.3 million EVs were sold in the U.S. in 2024, up 7.3% from 2023. The new administration announced $500 billion ($100 billion initially) in private sector in... » read more

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