tag: Arizona State University

Chip Industry Technical Paper Roundup: Nov. 5
By Linda Christensen - 05 Nov, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=378 /]   Further Reading Chip Industry Week In Review Silicon Valley design center and NY EUV Accelerator; Siemens’ big acquisition; Onto extends panel inspection with two acquisitions; DENSO-Quadric deal; thinner Si-based power wafer; $100M funding for AI; trade wars escalate; earnings rep... » read more

FPGA Fault Injection Attacks (ASU, KIT)
By Technical Paper Link - 29 Oct, 2024 - Comments: 0

A new technical paper titled "Hacking the Fabric: Targeting Partial Reconfiguration for Fault Injection in FPGA Fabrics" was published by researchers at Arizona State University and Karlsruhe Institute of Technology (KIT). Abstract "FPGAs are now ubiquitous in cloud computing infrastructures and reconfigurable system-on-chip, particularly for AI acceleration. Major cloud service providers s... » read more

Americas Chip Funding Energizes Industry
By Liz Allan - 23 Oct, 2024 - Comments: 0

This is the second in a series of articles tracking government chip investments. See part one here (global),  part 3 covering EMEA is here and Asia here. Since the first announcement of a non-binding preliminary memorandum of terms with BAE Systems in December 2023, the U.S. Department of Commerce has rolled out comprehensive plans to support more than a dozen companies in order to shore up... » read more

Research Bits: Sept. 24
By Jesse Allen - 24 Sep, 2024 - Comments: 0

Modeling negative capacitance Researchers from Lawrence Berkeley National Laboratory developed an open-source 3D simulation framework capable of modeling the atomistic origins of negative capacitance in ferroelectric thin films at the device level. When a material has negative capacitance, it can store a greater amount of electrical charge at lower voltages. The team believes the FerroX fra... » read more

Chip Industry Week in Review
By The SE Staff - 30 Aug, 2024 - Comments: 1

The Biden-Harris Administration announced preliminary terms with HP for $50 million in direct funding under the CHIPs and Science Act to support the expansion and modernization of HP’s existing microfluidics and microelectromechanical systems (“MEMS”) facility in Corvallis, Oregon. CHIPS for America launched the CHIPS Metrology Community, a collaborative initiative designed to advance ... » read more

Will AI Disrupt EDA?
By Brian Bailey - 25 Jul, 2024 - Comments: 1

Generative AI has disrupted search, it is transforming the computing landscape, and now it's threatening to disrupt EDA. But despite the buzz and the broad pronouncements of radical changes ahead, it remains unclear where it will have impact and how deep any changes will be. EDA has two primary roles — automation and optimization. Many of the optimization problems are NP hard, which means ... » read more

Chip Industry Technical Paper Roundup: July 8
By Linda Christensen - 08 Jul, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library. [table id=238 /] More ReadingTechnical Paper Library home » read more

Chip Industry Week In Review
By The SE Staff - 28 Jun, 2024 - Comments: 0

The Design Automation Conference morphed into the Chips to Systems Conference, reflecting an industry shift from monolithic SoCs to assemblies of chiplets in various flavors of advanced packaging. The change drew a slew of students and a resurgent buzz, fueled by discussions about heterogeneous integration, reliability, and ways to leverage AI/ML to speed up design and verification processes. ... » read more

Overview of Test Strategies for 3DICs
By Technical Paper Link - 26 Jun, 2024 - Comments: 0

A new technical paper titled "Design-for-Test Solutions for 3D Integrated Circuits" was published by researchers at Duke University, Arizona State University, and NVIDIA. Abstract: "As Moore's Law approaches its limits, 3D integrated circuits (ICs) have emerged as promising alternatives to conventional scaling methodologies. However, the benefits of 3D integration in terms of lower power co... » read more

Chip Industry Week In Review
By The SE Staff - 17 May, 2024 - Comments: 0

President Biden will raise the tariff rate on Chinese semiconductors from 25% to 50% by 2025, among other measures to protect U.S. businesses from China’s trade practices. Also, as part of President Biden’s AI Executive Order, the Administration released steps to protect workers from AI risks, including human oversight of systems and transparency about what systems are being used. Intel ... » read more

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