tag: ARM

The Uncertainties Of RISC-V Compliance
By Ann Mutschler - 22 Jun, 2023 - Comments: 0

How far can a RISC-V design be pushed and still be compliant? The answer isn't always black-and-white because the RISC-V concept is very different from previous open-source projects. But as interest and activity in RISC-V continues to grow, constructive discussions are taking place to address some of the challenges of designing with an open-standard ISA. “The RISC-V standard is somethin... » read more

Blog Review: June 21
By Jesse Allen - 21 Jun, 2023 - Comments: 0

Synopsys' Vikram Bhatia identifies four trends driving the migration of EDA tools and chip design workloads to the cloud, from ever-increasing compute and time-to-market demands to advanced cybersecurity features. Cadence's Veena Parthan checks out how computational fluid dynamics and finite element analysis can help improve aquaculture with sustainable fish cage nets that minimize stagnatio... » read more

CEO Outlook: Chiplets, Data Management, And Reliability
By Ed Sperling - 14 Jun, 2023 - Comments: 0

Semiconductor Engineering sat down to talk about changes in chip design with Joseph Sawicki, executive vice president for IC EDA at Siemens Digital Industries Software; John Kibarian, president and CEO of PDF Solutions; John Lee, general manager and vice president of Ansys' Semiconductor Business Unit; Niels Faché, vice president and general manager of PathWave Software Solutions at Keysight; ... » read more

Blog Review: June 14
By Jesse Allen - 14 Jun, 2023 - Comments: 0

Synopsys' Richard Solomon and Gary Ruggles examine the Compute Express Link (CXL) protocol and how it could unlock new ways of doing computing such as enabling efficient heterogeneous computing architectures, accelerating data-intensive workloads, and facilitating advanced real-time analytics. Cadence's Andre Baguenie explains how to convert an electrical signal to a logic value using the Ve... » read more

Week In Review: Semiconductor Manufacturing, Test
By Gregory Haley - 09 Jun, 2023 - Comments: 0

The European Union’s Chips Act Commission has approved €8.1 billion ($8.73 billion) in funding for an Important Project of Common European Interest (IPCEI). As part of this IPCEI, 56 companies, including small and medium-sized enterprises (‘SMEs') and start-ups, will undertake 68 projects in research, innovation, and deployment of microelectronics and communication technologies across th... » read more

Week In Review: Design, Low Power
By Jesse Allen - 09 Jun, 2023 - Comments: 0

Renesas Electronics completed its acquisition of Panthronics, a fabless company specializing in near-field communication (NFC) wireless products. Renesas has already incorporated Panthronics NFC technology into several solution reference designs for applications such as payment, IoT, asset tracking, and smart meters. The European Commission announced new funding for the semiconductor and mic... » read more

Programming Processors In Heterogeneous Architectures
By Ann Mutschler - 08 Jun, 2023 - Comments: 0

Programming processors is becoming more complicated as more and different types of processing elements are included in the same architecture. While systems architects may revel in the number of options available for improving power, performance, and area, the challenge of programming functionality and making it all work together is turning out to be a major challenge. It involves multiple pr... » read more

How To Address The Top 5 Silicon Startup Challenges
By Neil Parris - 08 Jun, 2023 - Comments: 0

From our 30 years of experience, Arm understands that designing silicon can be complex and expensive. Against the backdrop of global supply chain issues and wider economic challenges, today’s climate can be challenging for the tech industry, particularly those creating the next wave of silicon products. Startups are looking for every opportunity to maximize their success with their first t... » read more

Blog Review: June 7
By Jesse Allen - 07 Jun, 2023 - Comments: 0

Synopsys' Kenneth Larsen and Powerchip's S.Z. Chang explore wafer-on-wafer (WoW) and chip-on-wafer (CoW), 3D hybrid bonding schemes that can be used to stack memory on logic with shorter signal transmission distance at no wasted power and more interconnect and bandwidth density. In a podcast, Siemens' Conor Peick, Nand Kochhar, and Mark Sampson chat about how companies can address growing co... » read more

Arm SystemReady Certification System Requirements Specification v2.1
By Arm - 07 Jun, 2023 - Comments: 0

Systems that are designed to “just work” for the end user (with the ability to install and run generic off-the-shelf operating systems out-of-the-box) need to follow a set of minimum hardware and firmware requirements to ensure compatibility. For hardware, the Arm SystemReady Program defines a common Base System Architecture (BSA) specification and a set of market-specific supplements. F... » read more

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