Week In Review: Design, Low Power

By Jesse Allen - 21 Jul, 2023 - Comments: 0

Cadence will acquire Rambus' SerDes and memory interface PHY IP business. Rambus will retain its digital IP business, including memory and interface controllers and security IP. “With this transaction, we will increase our focus on market-leading digital IP and chips and expand our roadmap of novel memory solutions to support the continued evolution of the data center and AI,” said Sean Fan... » read more

Getting Rid Of Heat In Chips

By Brian Bailey - 20 Jul, 2023 - Comments: 1

Power consumed by semiconductors creates heat, which must be removed from the device, but how to do this efficiently is a growing challenge. Heat is the waste product of semiconductors. It is produced when power is dissipated in devices and along wires. Power is consumed when devices switch, meaning that it is dependent upon activity, and that power is constantly being wasted by imperfect de... » read more

Improved Arm Server Price-Performance For HPC

By David Lecomber - 20 Jul, 2023 - Comments: 0

The availability of Amazon EC2 Hpc7g instances with the AWS Graviton3E and Elastic Fabric Adapter (EFA) is opening new opportunities in key areas: Manufacturing Aerospace Automotive engineering Weather prediction The new AWS EC2 instance types have AWS Graviton3E’s 64 Arm Neoverse V1 cores and 8 channels of DDR5 memory. This is alongside the AWS Nitro v5 card with EFA deliver... » read more

Blog Review: July 19

By Jesse Allen - 19 Jul, 2023 - Comments: 0

Siemens' Keith Felton argues that co-design-driven semiconductor package planning and prototyping is critical for design success and points to how interchange formats enable designers to make trade-off decisions for both the package and the board and communicate those recommendations back to the other design team in formats that are native to their tools. Cadence's Xin Mu explains precoding ... » read more

Spectre-BHB: Speculative Target Reuse Attacks Version 1.7

By Arm - 19 Jul, 2023 - Comments: 0

In March 2022, researchers within the Systems and Network Security Group at Vrije Universiteit Amsterdam disclosed a new cache speculation vulnerability known as Branch History Injection (BHI) or Spectre-BHB. Spectre-BHB is similar to Spectre v2, except that malicious code uses the shared branch history (stored in the CPU Branch History Buffer, or BHB) to influence mispredicted branches within ... » read more

DAC/Semicon West Wednesday

By The SE Staff - 13 Jul, 2023 - Comments: 1

Trade restrictions against China were a regular topic of discussion at both DAC and Semicon West this week. Five Chinese startups exhibited prominently at this week's Design Automation Conference, in the wake of increasingly restrictive trade regulations that limit the sale of U.S. and European EDA tools used to develop advanced semiconductors. Most attendees interviewed said privately th... » read more

Solving The Last-Mile Delivery Problem

By John Koon - 06 Jul, 2023 - Comments: 0

Retailers are deploying robots to cut costs and improve efficiency, opening new opportunities for chipmakers as well as a host of new challenges. Key to this strategy are autonomous roadside delivery robots (ARDRs). Retailers have been facing razor-thin profit margins for years and have turned their sights to increasing operational efficiency to stay competitive. Solving the last-mile delive... » read more

Curbing Automotive Cybersecurity Attacks

By John Koon - 06 Jul, 2023 - Comments: 1

The relentless cyberattacks on the automotive sector are not limited to vehicles and have an impact on the entire automotive supply chain, so the pressure is on the automotive ecosystem to understand the necessary standards and regulations for vehicles and components. While the process of attaining compliance adds additional effort, in the long run, the increase in cybersecurity will save the a... » read more

Innovative NoC Implementation Dramatically Speeds Derivative Design

By Arteris - 05 Jul, 2023 - Comments: 0

The Inuitive team faced a significant challenge when developing a derivative design based on the NU4000, their first vision-on-chip processor. The NU4000 employs the Advanced eXtensible Interface (AXI) on-chip communication bus protocol developed by Arm. However, removing one of the NU4000’s three vector cores resulted in access to only a limited number of AXI ports. The problem was that ... » read more

Challenges Grow For Data Management And Sharing In EDA

By Ed Sperling - 29 Jun, 2023 - Comments: 0

Semiconductor Engineering sat down to talk about more openness in EDA data, how increased complexity is affecting time to working silicon, and the impact of geopolitics, with Joseph Sawicki, executive vice president for IC EDA at Siemens Digital Industries Software; John Kibarian, president and CEO of PDF Solutions; John Lee, general manager and vice president of Ansys' Semiconductor Business U... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

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by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

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by Karen Heyman

What Comes After HBM For Chiplets

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Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

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New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.