Blog Review: May 3


Synopsys' Thomas Andersen considers the requirements of AI-optimized chips that are resulting in exploration of different memory configurations, different types of memory, and different types of processor technologies and software components. Cadence's Girish Vaidyanathan considers the role of hierarchy and partitioning in custom design and looks at how a virtual hierarchy allows layout desi... » read more

Startup Funding: April 2023


Packaging was a hot spot in April, with one of the largest rounds going to a middle-end-of-line advanced packaging company. A second packaging company also drew significant funding for its focus on wafer-level packaging for CMOS image sensors. Two packaging substrate manufacturers also saw investment. Two photoresist makers also drew sizeable rounds. Both they and the packaging companies are... » read more

Improved DSP And AI Performance On An MCU Core


In the world of embedded devices, there's a growing demand for advanced machine learning and signal processing capabilities. ARM Cortex-M85, the latest general-purpose core, aims to meet these demands with its 32-bit Armv8.1-M architecture, offering high performance and power efficiency. The core's Helium technology, M-profile vector extension (MVE), provides significant uplift for ML/DSP appl... » read more

Blog Review: April 26


Codasip's Tora Fridholm introduces the NimbleAI project, an effort to design a neuromorphic sensing and processing 3D integrated chip that implements an always-on sensing stage, highly specialized event-driven processing kernels and neural networks to perform visual inference of selected stimuli using the bare minimum amount of energy. Synopsys' Anjaneya Thakar discusses computational lithog... » read more

Blog Review: April 19


Synopsys' Soren Smidstrup and Kerim Genc explore how materials modeling helps battery designers explore the wide playing field for new battery materials and optimize performance by co-designing the structure and chemistry of new batteries, ultimately shortening development time and cost. Siemens' Stephen Chavez finds that enabling multiple engineers to work simultaneously within the same PCB... » read more

Week In Review: Semiconductor Manufacturing, Test


U.S. Senate Majority Leader Chuck Schumer said he launched an effort to establish rules on artificial intelligence to address national security and education concerns, Reuters reported. "Time is of the essence to get ahead of this powerful new technology to prevent potentially wide-ranging damage to society and national security and instead put it to positive use by advancing strong, bipartisan... » read more

Week In Review: Design, Low Power


Arm and Intel Foundry Services inked a multi-generation agreement to enable chip designers to build Arm-based SoCs on the Intel 18A process. The initial focus is mobile SoC designs, but the deal allows for potential expansion into automotive, IoT, data center, aerospace, and government applications. IFS and Arm will undertake design technology co-optimization (DTCO) to optimize chip design and ... » read more

Week In Review: Auto, Security, Pervasive Computing


Public USB phone charging stations are now another vector that bad actors can use to plant malware and steal data on devices — known as "juice jacking," according to the United States’ Federal Communications Commission (FCC). The FCC is encouraging people to stay away from these public charging stations, found in airports and hotels, because of bad actors can install malware on the charging... » read more

Introducing Device Virtualization Principles For Real-Time Systems


The rising market share of electric vehicles and the reduction in combustion engines required in the future is transforming the automotive industry. One could think this would lead to a simplification in vehicle design, but with driver assistance technologies becoming a key differentiator, they are in fact becoming real "data centers on wheels." Furthermore, car drivers are used to a consumer-b... » read more

RISC-V Driving New Verification Concepts


Semiconductor Engineering sat down to discuss gaps in tools and why new methodologies are needed for RISC-V processors, with Pete Hardee, group director for product management at Cadence; Mike Eftimakis, vice president for strategy and ecosystem at Codasip; Simon Davidmann, founder and CEO of Imperas Software; Sven Beyer, program manager for processor verification at Siemens EDA; Kiran Vittal, ... » read more

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