tag: ARM

Putting Limits On What AI Systems Can Do
By Ed Sperling - 22 Apr, 2021 - Comments: 0

New techniques and approaches are starting to be applied to AI and machine learning to ensure they function within acceptable parameters, only doing what they're supposed to do. Getting AI/ML/DL systems to work has been one of the biggest leaps in technology in recent years, but understanding how to control and optimize them as they adapt isn't nearly as far along. These systems are generall... » read more

Tapping Into Non-Volatile Logic
By Bryon Moyer - 21 Apr, 2021 - Comments: 0

Research is underway to develop a new type of logic device, called non-volatile logic (NVL), based on ferroelectric FETs. FeFETs have been a topic of high interest at recent industry conferences, but the overwhelming focus has been using them in memory arrays. The memory bit cell, however, is simply a transistor that can store a state. That can be leveraged in other applications. “Non-v... » read more

Blog Review: April 21
By Jesse Allen - 21 Apr, 2021 - Comments: 0

Synopsys' Taylor Armerding warns that without making cybersecurity a priority, companies may be positioning themselves as the weak link in the supply chain, and provides some tips for protecting both the company and its customers. Siemens EDA's Simon Favre points to critical area analysis and design for manufacturing as two important strategies to improve IC yield and quality. Cadence's P... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 16 Apr, 2021 - Comments: 0

Pervasive computing — IoT, edge, cloud, data center, and back PC maker Dell Technologies is spinning off 81% equity ownership of VMWare to two standalone public companies. VMWare, founded in 1998, provides software to manage networking, apps, and cloud/data center. VMWare will pay a special dividend to its investing, which will generate $9.3 – $9.7 billion for Dell to use toward cutting it... » read more

Blog Review: April 14
By Jesse Allen - 14 Apr, 2021 - Comments: 0

Siemens EDA's Jake Wiltgen provides an overview of setting up an executing a fault injection campaign to prove that the IC or IP will safely operate under a faulted state caused by a random hardware failure, required to meet higher ASIL targets for ISO 26262 functional safety certification. Synopsys' Taylor Armerding considers the state of medical device security and the growing attack surfa... » read more

Many Chiplet Challenges Ahead
By Brian Bailey - 12 Apr, 2021 - Comments: 0

Over the past couple of months, Semiconductor Engineering has looked into several aspects of 2.5D and 3D system design, the emerging standards and steps that the industry is taking to make this more broadly adopted. This final article focuses on the potential problems and what remains to be addressed before the technology becomes sustainable to the mass market. Advanced packaging is seen as ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 09 Apr, 2021 - Comments: 0

Government policy At one point, there was a school of thought that the Biden administration would relax the current tariffs and export controls in regards to China. So far, the Biden administration hasn’t changed any of the previous policies and is doubling down on those efforts. The Department of Commerce’s Bureau of Industry and Security (BIS) this week added seven Chinese supercomput... » read more

Week In Review: Design, Low Power
By Jesse Allen - 09 Apr, 2021 - Comments: 0

Tools & IP Cadence debuted the Palladium Z2 Enterprise Emulation and Protium X2 Enterprise Prototyping systems. The Palladium Z2 is based on a new custom emulation processor, while the Protium X2 is based on Xilinx UltraScale+ VU19P FPGAs. Designed to work together with a common front-end flow, they provide 2X capacity and 1.5X performance improvements over the previous generations, and ne... » read more

3D Stacking For Performance And Efficiency
By Brian Cline - 08 Apr, 2021 - Comments: 0

Moore’s Law scaling is slowing down and limited improvements in performance, power, area, and cost are available from one process node to the next. As a result, advanced packaging and 3D stacking technologies are taking a front seat as the key drivers for next-generation high-performance energy-efficient designs. These types of system-in-package (SiP) technologies require designers to reima... » read more

Energy Harvesting Shows New Signs of Life
By Bryon Moyer - 08 Apr, 2021 - Comments: 1

Energy harvesting is seeing renewed activity in select markets, years after some high-profile attempts to build this into consumer electronics stalled out. Costs, manufacturing challenges, and market resistance kept this technology from moving forward, more than a decade after it was being touted as the best way forward for consumer electronics and devices that were hard to access. While sol... » read more

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