Week In Review: Auto, Security, Pervasive Computing


An effort to fund U.S. science and technology initiatives with at least $100 billion is getting a thumbs up from the SIA (Semiconductor Industry Association). The Endless Frontier Act —  a bipartisan, bicameral bill introduced on Thursday in the U.S. House of Representatives — will invest money into semiconductor research and development and other related fields such as material science, q... » read more

Digital Immersion: The Next Step Towards The Future Of Mobile Devices And Connectivity


In considering how far we’ve come with mobile devices just in the last two decades, it’s entertaining to think about the next ten years. When asking the new power users, Generation Z or the “digital natives,” a couple of key themes emerge, both for mobile devices, as well as for the networks they reside in. Some key advancements have been made this week with the announcement of Arm’s ... » read more

What’s So Important About Processor Extensibility?


While the ability to extend a processor is nothing new, market dynamics are forcing a growing percentage of the industry to consider it a necessary part of their product innovation. From small IoT functions to massive data centers and artificial intelligence, the need to create an optimized processing platform is often the only way to get more performance or lower power out of the silicon area ... » read more

What Will The Next-Gen Verification Flow Look Like?


Semiconductor Engineering sat down to discuss what's ahead for verification with Daniel Schostak, Arm fellow and verification architect; Ty Garibay, vice president of hardware engineering at Mythic; Balachandran Rajendran, CTO at Dell EMC; Saad Godil, director of applied deep learning research at Nvidia; and Nasr Ullah, senior director of performance architecture at SiFive. What follows are exc... » read more

Blog Review: May 27


Mentor's Neil Johnson takes a look at achieving a practical verification methodology starting with an exclusively constrained random flow and building up by adding techniques and gauging the consequences. Cadence's Paul McLellan explains the history of neural networks and how we've been trying to mimic the brain for decades, only to see funding dry up until a sudden resurgence of annotated i... » read more

Blog Review: May 20


Synopsys' Jonathan Knudsen demystifies fuzzing techniques and why the process of sending targeted, intentionally invalid data is important to determining security. Mentor's Chris Spear explains both the potential benefits and challenges of the UVM Configuration Database and guidelines to improve performance. Cadence's Paul McLellan continues the look back at mobile history with the beginn... » read more

Week In Review: Design, Low Power


Tools & IP Synopsys released a range of IP for TSMC's 5nm process technology. It includes interface PHY IP such as 112G/56G Ethernet, Die-to-Die, PCIe 5.0, CXL, and CCIX; memory interface IP for DDR5, LPDDR5, and HBM2/2E; die-to-die PHYs for 112G USR/XSR connectivity and High-Bandwidth Interconnect; and foundation IP including logic libraries, multi-port memory compilers, and TCAMs. Sma... » read more

Week In Review: Auto, Security, Pervasive Computing


Security Ninety-one percent of commercial applications contain outdated or abandoned open-source components —a security threat, says Synopsys in its recently released report 2020 Open Source Security and Risk Analysis (OSSRA). In the fifth annual edition of the report, Synopsys’ research team in its Cybersecurity Research Center (CyRC) found that 99% of the 1,250 commercial codebases revie... » read more

iSIM With IoT SAFE For Seamless Authentication From Chip To Cloud


When transferring data over mobile networks, IoT devices need to exchange that data securely and establish trust with a public or edge cloud in a way that’s seamless, scalable and easy to manage. IoT SAFE (IoT SIM Applet For Secure End-2-End Communication) enables IoT device manufacturers and IoT service providers to leverage the SIM (Subscriber Identity Module) as a robust, scalable and stan... » read more

‘More Than Moore’ Reality Check


The semiconductor industry is embracing multi-die packages as feature scaling hits the limits of physics, but how to get there with the least amount of pain and at the lowest cost is a work in progress. Gaps remain in tooling and methodologies, interconnect standards are still being developed, and there are so many implementations of packaging that the number of choices is often overwhelming. ... » read more

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