ISO 26262:2018, 2nd Edition: What Changes?

By Kurt Shuler - 07 Feb, 2019 - Comments: 0

If you’re involved somehow in design for automotive electronics, you probably have more than a cursory understanding of the ISO 26262 standard. What your organization is working from is most likely the 2011 definition. The most recent update is formally known as ISO 26262:2018, less formally as ISO 26262 2nd Edition. Figure 1. Overview of the ISO 26262:2018 series of standards (Source IS... » read more

The Race To Multi-Domain SoCs

By Ed Sperling - 07 Feb, 2019 - Comments: 0

K. Charles Janac, president and CEO of Arteris IP, sat down with Semiconductor Engineering to discuss the impact of automotive and AI on chip design. What follows are excerpts of that conversation. SE: What do you see as the biggest changes over the next 12 to 24 months? Janac: There are segments of the semiconductor market that are shrinking, such as DTV and simple IoT. Others are going ... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 01 Feb, 2019 - Comments: 0

Internet of Things Pepper IoT collaborated with the Dark Cubed cybersecurity firm to produce “The State of IoT Security Report,” which can be downloaded here. Pepper IoT is an Internet of Things platform and service provider. Key findings of the report: Device security is important, but the platform is much more critical; patching will not fix systemic problems; and the market must make se... » read more

Week In Review: Design, Low Power

By Jesse Allen - 25 Jan, 2019 - Comments: 0

M&A Ansys will acquire Helic, a provider of electromagnetic crosstalk analysis and signoff tools. Founded in 2000, Helic's tools included pre- and post-LVS EM modeling, inductor synthesis and modeling, and analysis of crosstalk risk. The company's technology will be integrated into a solution for on-chip, 3D integrated circuit and chip-package-system electromagnetics and noise analysis. Th... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 25 Jan, 2019 - Comments: 0

Internet of Things Tony Franklin, Intel’s general manager for Internet of Things Segments, is interviewed by Lorin Fries on how the chipmaker is helping to develop smart farming applications. “We focus primarily on high-performance computer technologies, as well as communication technologies, which have great applicability for food systems. We work closely with a broad ecosystem of partner... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 18 Jan, 2019 - Comments: 0

Internet of Things A dairy barn without any people working in it. An automated greenhouse for produce. Coming soon, little robots that will weed crop fields and look for diseased plants. This is Rivendale Farms, in the countryside west of Pittsburgh, which is 175 acres serving as a beta site for agricultural Internet of Things technology. The small farm has about 150 Jersey cows, each of which... » read more

Week In Review: Design, Low Power

By Jesse Allen - 18 Jan, 2019 - Comments: 0

M&A Rambus acquired the assets of Diablo Technologies. Founded in 2003, Diablo Technologies specialized in NVDIMM technologies, but was hit with a patent lawsuit by Netlist in 2013. While Diablo won the lawsuit and several subsequent appeals, it declared bankruptcy in December 2017. Rambus says the technology will provide a foundation for integrating existing DRAM and Flash along with emer... » read more

Chasing Reliability In Automotive Electronics

By Susan Rambo And Ed Sperling - 15 Jan, 2019 - Comments: 0

Assuring reliability in automotive electronics has set off a scramble across the semiconductor supply chain and unearthed a list of issues for which there is insufficient data, a lack of well-defined standards, and inconsistent levels of expertise. Reliable functional safety that spans 18 to 20 years of service in harsh environments, or under constant use with autonomous taxis or trucks, is ... » read more

AI Chips: NoC Interconnect IP Solves Three Design Challenges

By Kurt Shuler - 10 Jan, 2019 - Comments: 0

New network-on-chip (NoC) interconnect IP is now available for artificial intelligence (AI) systems-on-chip (SoC). Arteris IP launched the fourth generation of the FlexNoC interconnect IP with a new optional AI package. The novel NoC interconnect technologies solves many data flow problems in today’s AI designs. Innovative features address the requirements of the next-generation of AI chips t... » read more

Fundamentals of Semiconductor ISO 26262 Certification: People, Process and Product

By Arteris - 09 Jan, 2019 - Comments: 0

Written by Kurt Shuler, VP of Marketing at Arteris IP Developers of automotive semiconductor devices and electronic systems beware: There may be some vendors who claim their products meet the ISO 26262 safety standard requirements for integration into the production of passenger vehicles without fully understanding the nature of the challenge. These claims might be superficial if they fail... » read more

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tag: Arteris IP

ISO 26262:2018, 2nd Edition: What Changes?

The Race To Multi-Domain SoCs

Week in Review: IoT, Security, Auto

Week In Review: Design, Low Power

Week in Review: IoT, Security, Auto

Week in Review: IoT, Security, Auto

Week In Review: Design, Low Power

Chasing Reliability In Automotive Electronics

AI Chips: NoC Interconnect IP Solves Three Design Challenges

Fundamentals of Semiconductor ISO 26262 Certification: People, Process and Product