Autonomous Vehicle Design Begins To Change Direction

By Ann Mutschler - 06 Dec, 2018 - Comments: 0

Tools that are commonly used in semiconductor design are starting to be applied at the system level for assisted and autonomous vehicles, setting the stage for more complex simulated scenarios and electronic system design. Simulation is well understood for designing automotive ICs, but now it also is being used to design vehicle architectures and sensors, as well as for sensor miniaturizatio... » read more

Looking Beyond The CPU

By Brian Bailey - 29 Nov, 2018 - Comments: 0

CPUs no longer deliver the same kind of of performance improvements as in the past, raising questions across the industry about what comes next. The growth in processing power delivered by a single CPU core began stalling out at the beginning of the decade, when power-related issues such as heat and noise forced processor companies to add more cores rather than pushing up the clock frequency... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 02 Nov, 2018 - Comments: 0

Internet of Things The expensive implementation of 5G cellular communications may be justified by the Internet of Things, writes Hatem Zeine, founder and chief technology officer of Ossia, a developer of wireless power technology. Bain & Company forecasts the B2B IoT market will be worth more than $300 billion by 2020. IDC predicts overall IoT spending will hit $1.2 trillion in 2022. Mi... » read more

The Week In Review: Design

By Jesse Allen - 02 Nov, 2018 - Comments: 0

M&A GlobalFoundries formed Avera Semiconductor, a wholly-owned subsidiary focused on custom ASIC designs. While Avera will use its relationship with GF for 14/12nm and more mature technologies, it has a foundry partnership lined up for 7nm. The new company's IP portfolio includes high-speed SerDes, high-performance embedded TCAMs, ARM cores and performance and density-optimized embedded SR... » read more

AI Begins To Reshape Chip Design

By Ed Sperling - 01 Nov, 2018 - Comments: 1

Artificial intelligence is beginning to impact semiconductor design as architects begin leveraging its capabilities to improve performance and reduce power, setting the stage for a number of foundational shifts in how chips are developed, manufactured and updated in the future. AI—and machine learning and deep learning subsets—can be used to greatly improve the functional control and pow... » read more

Connected Cars: From Chip To City

By Ann Mutschler - 01 Nov, 2018 - Comments: 0

As the automotive industry moves closer to autonomous vehicles, ecosystem players are focusing on the infrastructure pieces needed to make autonomous technology a reality for the first adopters, which are most likely commercial fleets. Vehicle-to-infrastructure (V2I or v2i) is a communications model that allows vehicles to share information with the components that support a country's hi... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 19 Oct, 2018 - Comments: 0

Internet of Things At Arm TechCon, Arm unveiled its Neoverse brand identity, providing an infrastructure foundation for 5G, the Internet of Things, edge computing, and other applications. The Arm Neoverse IP will proliferate next year from Arm and its technology partners. With Arm’s “Ares” platform, to be introduced in 2019, the company promises to deliver 30% per-generation performance ... » read more

Week In Review: Design, Low Power

By Jesse Allen - 19 Oct, 2018 - Comments: 0

Arm announced its new roadmap promising 30% annual system performance gains on leading edge nodes through 2021. These gains are to come from a combination of microarchitecture design to hardware, software and tools. They are branding this new roadmap 'Neoverse.' The first delivery will be Ares – expected in early 2019 – for a 7nm IP platform targeting 5G networks and next-generation cloud t... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 12 Oct, 2018 - Comments: 0

Deals Dialog Semiconductor made a blockbuster deal with Apple – the chip company will license power management technologies and transfer some assets to Apple, which will use them in their internal chip research and development. More than 300 Dialog employees, mostly engineers, will join Apple, which will pay $300 million in cash for the transaction and prepay another $300 million for Dialog ... » read more

Week In Review: Design, Low Power

By Jesse Allen - 12 Oct, 2018 - Comments: 0

Deals AI startup Enflame (Suiyuan) Technology purchased multiple licenses of Arteris IP's FlexNoC interconnect IP for use as the on-chip communications backbone of its AI training chips for use in cloud datacenters. Enflame cited easy creation of regular topologies used in AI chips and the ability to take advantage of HBM2 memories. Phison, a maker of NAND flash controller ICs, inked�... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Arteris IP

Autonomous Vehicle Design Begins To Change Direction

Looking Beyond The CPU

Week in Review: IoT, Security, Auto

The Week In Review: Design

AI Begins To Reshape Chip Design

Connected Cars: From Chip To City

Week in Review: IoT, Security, Auto

Week In Review: Design, Low Power

Week in Review: IoT, Security, Auto

Week In Review: Design, Low Power