Uses, Limits And Questions For FPGAs In Autos


Programmable logic in automotive applications is essential, given the parade of almost constant updates and shifts in direction, but exactly where the technology will be used has become a moving target. This isn't entirely surprising in the automotive industry. Carmakers are moving into electrification and increasing levels of automation in fits and starts, sometimes with dramatic swings in ... » read more

Transient Thermal Analysis For M.2 SSD Thermal Throttling: Detailed CFD Model vs Network-Based Model


Solid State Drive (SSD) technology continues to advance toward smaller footprints with higher bandwidth and adoption of new I/O interfaces in the PC market segment. Power performance requirements are tightening in the design process to address specific requirement along with the development of SSD technology. To meet this aggressive requirement of performance, one major issue is thermal throttl... » read more

FPGA Design Tradeoffs Getting Tougher


FPGAs are getting larger, more complex, and significantly harder to verify and debug. In the past, FPGAs were considered a relatively quick and simple way to get to market before committing to the cost and time of developing an ASIC. But today, both FPGAs and eFPGAs are being used in the most demanding applications, including cloud computing, AI, machine learning, and deep learning. In some ... » read more

Synopsys FPGA Platform: Enabling Faster Design, Verification and Debug of FPGAs


Field programmable gate arrays (FPGAs) are no longer the co-processor of full-custom chips and application-specific integrated circuits (ASICs). Today's FPGA offerings include devices as large and complex as any ASIC system-on-chip (SoC) on the market. The dramatic increase in size, complexity and functionality means that many FPGA development teams are adopting ASIC-style design, verification ... » read more

SEM Analysis Reveals Real Cause Of Chip Failure


When it comes to ASIC design, DELTA’s motto is “first time right”. When the first wafers from the wafer fab showed severe electrical malfunction, we were extremely frustrated. To investigate the failure, the design team started electrical characterization of prototypes. Overall, a short between power and ground was observed and furthermore RF inputs exhibited strange VI characteristics. T... » read more

Week in Review: IoT, Security, Auto


Internet of Things The Wing unit of Alphabet this summer will begin making drone deliveries in the Vuosarri district of Helsinki, Finland. The unmanned aerial vehicles will bear food and other items from Herkku Food, a gourmet market, and the Café Monami restaurant. The drones will bear deliveries of up to 3.3 pounds over distances of up to 6.2 miles. Comcast is reportedly developing an in... » read more

The Weather Report: 2018 Study On IC/ASIC Verification Trends


Nobel Laureate Bob Dylan observed, “You don’t need a weatherman to know which way the wind blows.” Similarly, we can get a feeling for where our industry is going by attending to the flow of thought at conferences, on line, or in our daily business. But that gives us only a small window to observe the hurricane-like forces of the very large and complicated, extremely dynamic global semico... » read more

Home Automation IoT Company Cuts ASIC Testing Costs


digitalSTROM develops smart home automation solutions providing users with superior comfort and a whole new style of living. Based on proprietary ASIC and software, digitalSTROM’s solutions connect electrical household appliances through existing power lines and enable an intelligent home via light switches, free speaking using Amazon Echo, and other apps. Challenges At the heart of digit... » read more

The Other Side Of Makimoto’s Wave


Custom hardware is undergoing a huge resurgence across a variety of new applications, pushing the semiconductor industry to the other side of Makimoto's Wave. Tsugio Makimoto, the technologist who identified the chip industry’s 10-year cyclical swings between standardization and customization, predicted there always will be room in ASICs for general-purpose processors. But it's becoming mo... » read more

The Problem With Post-Silicon Debug


Semiconductor engineers traditionally have focused on trying to create 'perfect' GDSII at tape-out, but factors such as hardware-software interactions, increasingly heterogeneous designs, and the introduction of AI are forcing companies to rethink that approach. In the past, chipmakers typically banked on longer product cycles and multiple iterations of silicon to identify problems. This no ... » read more

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