Use of NoC IP Facilitates Tailoring SoC Platform Design into Bespoke SoC Devices

By Arteris - 27 Jun, 2024 - Comments: 0

Customer Overview Dream Chip Technologies is a German company that originated from a research think tank initiative comprised of private companies and government-funded organizations in the beginning of 1990. The results from this effort were foundational in establishing German mastery of microelectronics. Dream Chip Technologies started as a design services provider, developing intellectua... » read more

Building Better Cars Faster

By John Koon - 02 Feb, 2023 - Comments: 0

Carmakers are accelerating their chip and electronic design schedules to remain competitive in an increasingly fast-changing market, but they are encountering gaps in the tooling, the supply chain, and in the methodologies they use to create those cars. While it's easy to envision how CAD software could be used to create the next new vehicle’s 3-D look, and how simulation software helps de... » read more

Rambus RT-640 Road To ISO26262 Certification

By Rambus - 05 Oct, 2022 - Comments: 0

Modern vehicles incorporate an increasing number of complex integrated circuits. Failures in automotive systems can lead to damage to property, injury or loss of life. Ensuring the reliability of electronic systems is crucial, and the ISO26262 standard documents the requirements for determining automotive functional safety. This whitepaper details the process for how Rambus achieved t... » read more

Rambus RT-640 Road To ISO 26262 Certification

By Rambus - 31 Aug, 2022 - Comments: 0

Modern vehicles incorporate an increasing number of complex integrated circuits. Failures in automotive systems can lead to damage to property, injury or loss of life. Ensuring the reliability of electronic systems is crucial, and the ISO26262 standard documents the requirements for determining automotive functional safety. This white paper details the process for how Rambus achieved the ISO262... » read more

Ensuring Functional Safety In Design

By Ed Sperling - 05 Feb, 2020 - Comments: 0

Mohammed Abdelwahid (Ali), automotive logic test product manager at Mentor, a Siemens Business, discusses how to maximize coverage in the different ASIL standards for logic BiST, how to make testing more efficient, and what impact that has on area and test time. » read more

Adding Safety Into Automotive Design

By Ann Mutschler - 04 Oct, 2018 - Comments: 0

The ISO 26262 spec is a household term for anyone even remotely involved with the automotive industry today. Increasingly, though, it is being used interchangeably with safety-readiness across the entire supply chain. ISO 26262 compliance is a prerequisite for IP and chips used in an increasing number of automotive applications. It applies to systems, software, and to individual products. An... » read more

FPGAs Drive Deeper Into Cars

By Ann Mutschler - 09 Jul, 2018 - Comments: 3

FPGAs are reaching deeper and wider inside of automobiles, playing an increasingly important role across more systems within a vehicle as the electronic content continues to grow. The role of FPGAs in automotive cameras and sensors is already well established. But they also are winning sockets inside of a raft of new technologies, ranging from the AI systems that will become the central logi... » read more

ISO 26262 Statistics

By Ed Sperling - 02 Jul, 2018 - Comments: 0

Jorg Gosse, functional safety product manager at OneSpin Solutions, talks about the statistics behind the standards, what is considered good enough, and how those numbers vary across different standards. https://youtu.be/cNTFN3kQ-OM » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: ASIL B