The Rise Of Copper Wires In Automotive ICs

By Prasad Dhond - 17 Nov, 2022 - Comments: 0

In 2011, the price of Gold (Au) surged to $1900/oz which had a drastic impact on Wirebonded ICs using Au wires. IC suppliers scrambled to convert from Au to copper (Cu) wire on as many products as they could. However, automotive ICs were reluctant to make the jump due to lack of reliability data and performance track-record. However, today’s automotive ICs are big users of Cu wires driven by ... » read more

Managing IP In Heterogeneous Designs

By Ed Sperling - 14 Nov, 2022 - Comments: 0

Increasing complexity and heterogeneity is creating huge challenges for tracking different versions of IP over the lifetime of chips. Pedro Pires, applications engineer at ClioSoft, talks about the implications of IP reuse in a complex, multi-IP context, including how different standards and database formats can affect IP tracking and why an interoperability layer is essential to tracking IP an... » read more

Improving Reliability In Automobiles

By John Koon - 14 Nov, 2022 - Comments: 0

Carmakers are turning to predictive and preventive maintenance to improve the safety and reliability of increasingly electrified vehicles, setting the stage for more internal and external sensors, and more intelligence to interpret and react to the data generated by those sensors. The number of chips inside of vehicles has been steadily rising, regardless of whether they are powered by elect... » read more

Weird Incidents Reveal L5 Challenges

By Marie C. Baca - 09 Nov, 2022 - Comments: 0

A series of surprising, counterintuitive, and sometimes bizarre incidents reveal the challenges of achieving full Level 5 autonomy in self-driving vehicles, which are an increasingly common site in major cities. While it’s easy to dismiss such anecdotes as humorous glitches compared with the sobering accounts of autonomous tech-related injuries and fatalities, industry executives say these oc... » read more

Next Steps For Improving Yield

By Laura Peters - 08 Nov, 2022 - Comments: 0

Chipmakers are ramping new tools and methodologies to achieve sufficient yield faster, despite smaller device dimensions, a growing number of systematic defects, immense data volumes, and massive competitive pressure. Whether a 3nm process is ramping, or a 28nm process is being tuned, the focus is on reducing defectivity. The challenge is to rapidly identify indicators that can improve yield... » read more

Automotive Applications Demand Silicon Lifecycle Management

By Pawini Mahajan - 08 Nov, 2022 - Comments: 0

Every electrical engineer learns early in university studies that automobiles are a highly demanding environment for electronics. Temperature and humidity extremes, noise and vibration, electrical interference, exposure to alpha particles, and other factors all make it hard to design and manufacture chips that will operate properly under all conditions. These challenges are exacerbated as chips... » read more

Are We Too Hard On Artificial Intelligence For Autonomous Driving?

By Frank Schirrmeister - 03 Nov, 2022 - Comments: 1

I recently attended and presented at Detroit's "Implementation of ISO 26262 & SOTIF" conference. Its subtitle was "Taking an Integrated Approach to Automotive Safety." After three days, my head was spinning with numbers of ISO/SAE and other standards. And at the end of day two, after yet another example that tricked autonomous driving prototypes into behaving wrongly, I sighed and asked whe... » read more

How Digital Twins Are Unlocking The Next Era Of Aerospace And Government Applications

By Ian Land - 31 Oct, 2022 - Comments: 0

By Ian Land, Jason Niatas, and Marc Serughetti Amidst changing economic waters and stringent manufacturing cycles, the aerospace, defense, and government landscape has seen an impressive technological evolution in the last few years. Innovations such as automating mission-critical systems and deploying advanced electronics in deep space exploration are expanding opportunities for government ... » read more

Technical and Structural Approaches To Centralize Automotive E/E Architectures

By Technical Paper Link - 26 Oct, 2022 - Comments: 0

A technical paper titled "Methodical Approach for Centralization Evaluation of Modern Automotive E/E Architectures" was published by researchers at University of Stuttgart and Daimler Truck AG. Abstract: "Centralization is considered as a key enabler to master the CPU-intensive features of the modern car. The development and architecture change towards the next generation car is influenced ... » read more

E-Mobility: Navigate Safety, Interoperability, And Conformance

By Keysight - 26 Oct, 2022 - Comments: 0

Although the concept of electric vehicles (EV) has been around for a while, the EV and EV supply equipment (EVSE) markets are not well-regulated or fully operational. This presents several challenges for EV and EVSE manufacturers throughout the e-mobility ecosystem. Safety, interoperability, and conformance are important criteria for enabling e-mobility, and Keysight is ready to help. Read this... » read more

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Knowledge Centers
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tag: automotive

The Rise Of Copper Wires In Automotive ICs

Managing IP In Heterogeneous Designs

Improving Reliability In Automobiles

Weird Incidents Reveal L5 Challenges

Next Steps For Improving Yield

Automotive Applications Demand Silicon Lifecycle Management

Are We Too Hard On Artificial Intelligence For Autonomous Driving?

How Digital Twins Are Unlocking The Next Era Of Aerospace And Government Applications

Technical and Structural Approaches To Centralize Automotive E/E Architectures

E-Mobility: Navigate Safety, Interoperability, And Conformance

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