tag: automotive

End In Sight For Chip Shortages?
By Mark LaPedus - 18 Nov, 2021 - Comments: 2

The current wave of semiconductor and IC packaging shortages is expected to extend well into 2022, but there are also signs that supply may finally catch up with demand. The same is true for manufacturing capacity, materials and equipment in both the semiconductor and packaging sectors. Nonetheless, after a period of shortages in all segments, the current school of thought is that chip suppl... » read more

A Broad Look Inside Advanced Packaging
By Mark LaPedus - 18 Nov, 2021 - Comments: 0

Choon Lee, chief technology officer of JCET, sat down with Semiconductor Engineering to talk about the semiconductor market, Moore’s Law, chiplets, fan-out packaging, and manufacturing issues. What follows are excerpts of that discussion. SE: Where are we in the semiconductor cycle right now? Lee: If you look at 2020, it was around 10% growth in the overall semiconductor industry. ... » read more

Zonal Architectures Play Key Role In Vehicle Security
By Ann Mutschler - 17 Nov, 2021 - Comments: 1

The automotive ecosystem is starting to shift toward zonal architectures, making vehicle functionality less dependent on the underlying hardware and allowing more flexibility in what gets processed where. The impact of that shift is both broad and significant. For carmakers, it could lead to hardware consolidation and more options for failovers in case something goes wrong with any system in... » read more

An FPGA-Based ECU for Remote Reconfiguration in Automotive Systems
By Technical Paper Link - 15 Nov, 2021 - Comments: 0

Abstract: "Growing interest in intelligent vehicles is leading automotive systems to include numerous electronic control units (ECUs) inside. As a result, efficient implementation and management of automotive systems is gaining importance. Flexible updating and reconfiguration of ECUs is one appropriate strategy for these goals. Software updates to the ECUs are expected to improve performance ... » read more

MIPI On Wheels: Enabling ADAS Applications
By Joseph Rodriguez - 11 Nov, 2021 - Comments: 0

Formed in 2003, the Mobile Industry Processor Interface (MIPI) Alliance brought together leading system and chip companies to provide standards for the essential video interface technologies for cameras and displays in phones. Over the years, the alliance has expanded its scope to publish specifications covering physical layer, multimedia, chip-to-chip and inter-processor communications (IPC), ... » read more

Coping With Parallel Test Site-to-Site Variation
By Anne Meixner - 09 Nov, 2021 - Comments: 1

Testing multiple devices in parallel using the same ATE results in reduced test time and lower costs, but it requires engineering finesse to make it so. Minimizing test measurement variation for each device under test (DUT) is a multi-physics problem, and it's one that is becoming more essential to resolve at each new process node and in multi-chip packages. It requires synchronization of el... » read more

Automotive Keyless Entry SoC Test Methodologies And Techniques
By Philip Brock - 09 Nov, 2021 - Comments: 0

By Philip Brock, Louis Benton, Jr., and Jonvyn Wongso Passive Entry Passive Start (PEPS) technology has become standard in the automotive market for keyless operation. A secure wireless communication system, PEPS enables you to lock and unlock the vehicle, and start and stop the vehicle without physically using the key. Electronic functionality embedded in the key fob to interact with the ve... » read more

Shifting Vehicle System Development Left With Virtual ECUs
By Marc Serughetti - 04 Nov, 2021 - Comments: 0

Developing electrical and electronic content for vehicles has always been an engineering and manufacturing challenge. The road is an exceptionally rough environment for components: temperature and humidity change constantly while noise and vibration pummel all parts of the vehicle. The nature of high-speed travel requires safety and reliability, which must be achieved in the presence of the dif... » read more

Optimizing System-Level Connectivity In Heterogenous Automotive Packages
By Keith Felton - 04 Nov, 2021 - Comments: 0

By Keith Felton and Cristina Somma With the massive growth of electronics in the automotive sector (such as autonomous driving, electric vehicles, and safety systems), the complexity, capabilities, and volume of semiconductors is rapidly increasing the demand for greater package connectivity density. This has led to high-end IC-package solutions, such as copper pillar bumping with very fi... » read more

Ethernet Time-Sensitive Networking Adoption In The Automotive Industry
By Krunal Patel - 04 Nov, 2021 - Comments: 0

At a particular point in time, the automotive industry continued to add more and more sensors and electronic control units to vehicles. All these sensors and actuators used to connect through CAN and LIN buses. However, since the introduction of IVN (In-Vehicle Network), the industry has started replacing these buses with automotive Ethernet. According to NXP, “Ethernet enables broadband co... » read more

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