Designing Application-Specific Processors for Wireless 5G SoCs

By Synopsys - 25 May, 2022 - Comments: 0

Traditional architectures for wireless baseband applications are no longer adequate for recent and next-generation modem standards. Supporting complex and still evolving standards like 5G in a single modem is only possible by using SDR techniques, which place increasing demands on performance and power consumption on the SoC. ASIP architectures enable full customization of a processor, which... » read more

Accelerating 5G Baseband With Adaptive SoCs: Part II

By Awanish Verma - 02 Sep, 2021 - Comments: 0

In my previous blog, we discussed 5G split architectures with focus on the widely adopted option 7-2 split. In this article, we will cover the implementation of the fronthaul and L1 Hi-PHY for 5G base stations. The 5G distributed unit (DU) can be implemented to process fronthaul data with O-RAN processing and partial offload for Hi-PHY processing which includes the LDPC encoder, LDPC decoder an... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 15 May, 2020 - Comments: 0

Security Ninety-one percent of commercial applications contain outdated or abandoned open-source components —a security threat, says Synopsys in its recently released report 2020 Open Source Security and Risk Analysis (OSSRA). In the fifth annual edition of the report, Synopsys’ research team in its Cybersecurity Research Center (CyRC) found that 99% of the 1,250 commercial codebases revie... » read more

5G Design Changes

By Ed Sperling - 07 Jun, 2019 - Comments: 0

Mike Fitton, senior director of strategic planning at Achronix, talks with Semiconductor Engineering about the two distinct parts of 5G deployment, how to get a huge amount of data from the core to the edge of a device where it is usable, and how a network on chip can improve the flow of data. » read more

The Basics of Amplitude Modulation

By NI - 12 Mar, 2019 - Comments: 0

Modulation is the process of varying a higher frequency carrier wave to transmit information. Though it is theoretically possible to transmit baseband signals (or information) without modulating it, it is far more efficient to send data by modulating it onto a higher frequency "carrier wave." Higher frequency waves require smaller antennas, use the available bandwidth more efficiently, and are ... » read more

DAC 2017: A Glimpse Of How The Future Is Enabled

By Frank Schirrmeister - 29 Jun, 2017 - Comments: 0

Last week’s Design Automation Conference in Austin gave great examples on how the future is enabled with next generation tools today. My favorite portions were Uhnder’s overview on “Agile Emulation” in the cloud, SirusXM’s presentation on how they used our portfolio of emulation and FPGA-based prototyping, the panel on “Smarter Verification” that I had organized and – of course ... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer